TCXO SMD 2.5x2.0 19.2MHz

Features:  Ultra Miniature SMD Package  Good Frequency Stability  Good Phase Noise Response  Moisture Sensitivity Level (MSL) : Level-1 Description and Applications: Surface mount 2.5mmx2.0mm TCXO for use in wireless communications devices

文件：511.92 Kbytes 页数：9 Pages

TAI-SAW

嘉硕科技

SMD 4x2.5 13.0MHz Crystal Unit

Features: Surface Mount Seam Weld Package Excellent Reliability Performance Good Frequency Perturbation and Stability over Temperature Ultra Miniature Package Description and Applications: Surface mount 4.0mmx2.5mm crystal unit for use in wireless telecommunications devices, especially fo

文件：226.35 Kbytes 页数：5 Pages

TAI-SAW

嘉硕科技

SMD Schottky Barrier Diode

Features - Low forward voltage. - Designed for mounting on small surface. - Extremely thin package. - Majority carrier conduction. - AEC-Q101 Qualified & PPAP.

文件：475.03 Kbytes 页数：4 Pages

COMCHIP

典琦

AMCC Series Cut Core FINEMET® F3CC Series Cut Core

文件：949.92 Kbytes 页数：4 Pages

ETCList of Unclassifed Manufacturers

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SMD Schottky Barrier Diode

Features IO = 350mA VR = 20V to 40V - Low forward voltage - Designed for mounting on small surface. - Extremely thin package. - Majority carrier conduction. - Lead-free device Mechanical Data - Case : 0603(1608) 1005(2512) standard package, molded plastic. - Terminals : Gold plated

文件：149.6 Kbytes 页数：3 Pages

ANACHIP

易亨电子