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TSI382

PCIe® to PCI Bridge Product Brief

Features General • PCI Express to PCI bridge • Transparent, Non-transparent and Opaque modes • Efficient queuing and buffering for low latency and high throughput • Compliant with the following specifications: – PCI Express Base 1.1 – PCI Express PCI/PCI-X Bridge 1.0 – PCI-to-PCI Bridge A

文件:395.59 Kbytes 页数:3 Pages

RENESAS

瑞萨

TSI382

PCIe to PCI Bridge

The Tsi382 provides a high performance, small footprint bridge from single lane PCI Express to 32 bit PCI. The device's PCI interface can operate up to 66 MHz. Three types of addressing modes are supported; transparent, opaque and non-transparent, giving designers flexibility. • PCI Express (x1) to PCI forward bridge\n• Superior performance, low latency\n• Clock and arbitration pins for up to 4 PCI devices\n• Non-transparent bridging support\n• Smallest form factor 10x10mm BGA package\n• 20x20mm LQFP package option;

Renesas

瑞萨

TSI382A

Legacy mode support for subtractive decode

The Tundra Semiconductor Tsi382A is a high-performance bus bridge that connects PCI Express based devices to legacy PCI devices. The Tsi382A’s PCIe Interface supports a x1 lane configuration, which enables the bridge to offer throughput performance of up to 2.5 Gbps per transmit and receive direct

文件:401.34 Kbytes 页数:2 Pages

IDT

TSI382A

PCIe to PCI Bridge

The Tsi382 provides a high performance, small footprint bridge from single lane PCI Express to 32 bit PCI. The device's PCI interface can operate up to 66 MHz. Three types of addressing modes are supported; transparent, opaque and non-transparent, giving designers flexibility. ·PCI Express (x1) to PCI forward bridge\n·Superior performance, low latency\n·Clock and arbitration pins for up to 4 PCI devices\n·Non-transparent bridging support\n·Smallest form factor 10x10mm BGA package\n·20x20mm LQFP package option;

Renesas

瑞萨

TSI382-66IL

Package:144-LFBGA;包装:托盘 类别:集成电路(IC) 专用 描述:IC INTFACE SPECIALIZED 144CABGA

Renesas Electronics America Inc

Renesas Electronics America Inc

TSI382-66ILV

Package:144-LFBGA;包装:卷带(TR) 类别:集成电路(IC) 专用 描述:IC INTFACE SPECIALIZED 144CABGA

Renesas Electronics America Inc

Renesas Electronics America Inc

TSI382A-66CQY

Package:176-LQFP;包装:托盘 类别:集成电路(IC) 专用 描述:IC INTFACE SPECIALIZED 176TQFP

Renesas Electronics America Inc

Renesas Electronics America Inc

供应商型号品牌批号封装库存备注价格
TUNDRA
24+
BGA144
100
原装现货假一罚十
询价
TUNDRA
24+
BGA144
2000
原装现货,可开13%税票
询价
IDT
25+
QFP
5000
百分百原装正品 真实公司现货库存 本公司只做原装 可
询价
IDT
23+
原厂原包装
6000
全新原装假一赔十
询价
IDT
23+
QFP
8650
受权代理!全新原装现货特价热卖!
询价
IDT
BGAQFP
6688
15
现货库存
询价
TUNDRA
专业铁帽
FBGA
182
原装铁帽专营,代理渠道量大可订货
询价
TUNDRA
20+
FBGA
67500
原装优势主营型号-可开原型号增税票
询价
TUNDRA
23+
BULK BGA
30000
代理全新原装现货,价格优势
询价
IDT
24+
QFP
35210
原装现货/放心购买
询价
更多TSI382供应商 更新时间2025-10-10 8:01:00