Silver Wirebonding

KEY FEATURES Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures

文件：411.98 Kbytes 页数：2 Pages

AMKOR

安靠科技

Amkor offers a broad line of TQFP (Thin Quad Flat Pack) IC packages.

FEATURES 5 x 5 mm to 20 x 20 mm body size with 1.0 mm body height 32-176 lead counts Broad selection of die pad sizes available Pre-plated frames available Inverted pad configuration available Custom leadframe design available Cu, Au and Ag wire options Pb-free and RoHS compliant

文件：673.75 Kbytes 页数：2 Pages

AMKOR

安靠科技

Thin Profile Quad Flat Pack

文件：92.54 Kbytes 页数：2 Pages

STATSCHIP

Buzzer output, remote control carrier signal output, high-current drive port

Lower limit for operation guarantee for flash memory built-in type is 4.5 V

文件：370.37 Kbytes 页数：5 Pages

PANASONIC

松下

Buzzer output, remote control carrier signal output, high-current drive port

Lower limit for operation guarantee for flash memory built-in type is 4.5 V

文件：370.37 Kbytes 页数：5 Pages

PANASONIC

松下

Digital Terrestrial Broadcasting Reception LSI

文件：96.66 Kbytes 页数：1 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

LSI Assembly

文件：43.3 Kbytes 页数：2 Pages

ROHM

罗姆

Digital Terrestrial Broadcasting Reception LSI

文件：90.22 Kbytes 页数：1 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

Digital Terrestrial Broadcasting Reception LSI

文件：87.25 Kbytes 页数：1 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

LSI Assembly

文件：46.45 Kbytes 页数：2 Pages

ROHM

罗姆