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TPSM53603RDAR.B

TPSM53603 36-V Input, 3-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package – Industry’s smallest 36-V, 3-A footprint: 85-mm2 solution size (single-sided) – Low EMI: meets CISPR11 radiated emissions – Excellen

文件:1.61991 Mbytes 页数:35 Pages

TI

德州仪器

TPSM53603RDARG4

TPSM53603 36-V Input, 3-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package – Industry’s smallest 36-V, 3-A footprint: 85-mm2 solution size (single-sided) – Low EMI: meets CISPR11 radiated emissions – Excellen

文件:1.61991 Mbytes 页数:35 Pages

TI

德州仪器

TPSM53603RDARG4.A

TPSM53603 36-V Input, 3-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package – Industry’s smallest 36-V, 3-A footprint: 85-mm2 solution size (single-sided) – Low EMI: meets CISPR11 radiated emissions – Excellen

文件:1.61991 Mbytes 页数:35 Pages

TI

德州仪器

TPSM53604RDAR

TPSM53604 36-V Input, 4-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package – Industry’s smallest 36-V, 4-A footprint: 85 mm2 solution size (single sided) – Low EMI: meets CISPR11 radiated emissions – Excellen

文件:1.61698 Mbytes 页数:36 Pages

TI

德州仪器

TPSM53604RDAR.A

TPSM53604 36-V Input, 4-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package – Industry’s smallest 36-V, 4-A footprint: 85 mm2 solution size (single sided) – Low EMI: meets CISPR11 radiated emissions – Excellen

文件:1.61698 Mbytes 页数:36 Pages

TI

德州仪器

TPSM53604RDAR.B

TPSM53604 36-V Input, 4-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package – Industry’s smallest 36-V, 4-A footprint: 85 mm2 solution size (single sided) – Low EMI: meets CISPR11 radiated emissions – Excellen

文件:1.61698 Mbytes 页数:36 Pages

TI

德州仪器

TPSM53604RDARG4

TPSM53604 36-V Input, 4-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package – Industry’s smallest 36-V, 4-A footprint: 85 mm2 solution size (single sided) – Low EMI: meets CISPR11 radiated emissions – Excellen

文件:1.61698 Mbytes 页数:36 Pages

TI

德州仪器

TPSM53604RDARG4.A

TPSM53604 36-V Input, 4-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package – Industry’s smallest 36-V, 4-A footprint: 85 mm2 solution size (single sided) – Low EMI: meets CISPR11 radiated emissions – Excellen

文件:1.61698 Mbytes 页数:36 Pages

TI

德州仪器

TPSM5601R5

TPSM5601R5, 60-V Input, 1-V to 6-V Output, 1.5-A Power Module in an Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5.0-mm × 5.5-mm × 4.0-mm Enhanced HotRod™ QFN – Excellent thermal performance: up to 18-W output power at 85°C, no airflow – Standard footprint: single large thermal pad and all pins

文件:1.90677 Mbytes 页数:33 Pages

TI

德州仪器

TPSM5601R5H

TPSM5601R5Hx, 60-V Input, 1-V to 16-V Output, 1.5-A Power Module in Enhanced HotRod™ QFN Package

1 Features • Functional Safety-Capable – Documentation available to aid functional safety system design • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN – Excellent thermal performance: up to 18-W output power at 85°C, no airflow – Standard footprint: single large thermal pad and all pins acces

文件:1.83804 Mbytes 页数:34 Pages

TI

德州仪器

技术参数

  • Package:

    5.0 X 3.2 Ceramic6 PAD SMD

  • Logic (Output):

    LVPECL

  • Supply Voltage(s):

    2.5V ~ 3.3V

  • Frequency:

    0.750MHz ~ 800.000MHz

供应商型号品牌批号封装库存备注价格
TI/德州仪器
24+
B3QFN-15
9600
原装现货,优势供应,支持实单!
询价
NA
23+
NA
26094
10年以上分销经验原装进口正品,做服务型企业
询价
TI(德州仪器)
24+/25+
10000
原装正品现货库存价优
询价
TI
23+
B0QFN
50000
全新原装正品现货,支持订货
询价
80000
询价
TI(德州仪器)
2022+
8000
原厂原装,假一罚十
询价
TI/德州仪器
25+
B3QFN-15
8880
原装认准芯泽盛世!
询价
TI
25+
B3QFN (RDA)
6000
原厂原装,价格优势
询价
TI/德州仪器
23+
B3QFN15
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
TI/德州仪器
22+
WSON
9000
原装正品,支持实单!
询价
更多TPSM5供应商 更新时间2026-1-28 8:56:00