TPSM8286xA 2.4V to 5.5V Input, 4A/6A Step-Down Power Module with Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package

1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti

文件：3.09718 Mbytes 页数：43 Pages

TI

德州仪器

TPSM8286xx 2.4V to 5.5V Input, 4A/6A, Step-Down MagPack™ Power Module With Integrated Inductor and I2C interface

1 Features • Up to 96% efficiency • Excellent thermal performance • I2C-compatible interface up to 3.4Mbps • 1% output voltage accuracy • DCS-Control topology for fast transient response • I2C Programmable: – Output voltage • 0.4 – 1.675V in 5mV steps • 0.8 – 3.35V in 10mV steps

文件：1.96191 Mbytes 页数：36 Pages

TI

德州仪器

TPSM8286xx 2.4V to 5.5V Input, 4A/6A, Step-Down MagPack™ Power Module With Integrated Inductor and I2C interface

1 Features • Up to 96% efficiency • Excellent thermal performance • I2C-compatible interface up to 3.4Mbps • 1% output voltage accuracy • DCS-Control topology for fast transient response • I2C Programmable: – Output voltage • 0.4 – 1.675V in 5mV steps • 0.8 – 3.35V in 10mV steps

文件：1.96191 Mbytes 页数：36 Pages

TI

德州仪器

TPSM8286xx 2.4V to 5.5V Input, 4A/6A, Step-Down MagPack™ Power Module With Integrated Inductor and I2C interface

1 Features • Up to 96% efficiency • Excellent thermal performance • I2C-compatible interface up to 3.4Mbps • 1% output voltage accuracy • DCS-Control topology for fast transient response • I2C Programmable: – Output voltage • 0.4 – 1.675V in 5mV steps • 0.8 – 3.35V in 10mV steps

文件：1.96191 Mbytes 页数：36 Pages

TI

德州仪器

TPSM8286xA 2.4V to 5.5V Input, 4A/6A Step-Down Power Module with Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package

1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti

文件：3.09718 Mbytes 页数：43 Pages

TI

德州仪器

TPSM8286xA 2.4V to 5.5V Input, 4A/6A, Step-Down Power Module With Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package

1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti

文件：3.33733 Mbytes 页数：46 Pages

TI

德州仪器

TPSM8286xA 2.4V to 5.5V Input, 4A/6A, Step-Down Power Module With Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package

1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti

文件：3.33733 Mbytes 页数：46 Pages

TI

德州仪器

丝印：TM866AA0H；Package：B0QFN；TPSM8286xA 2.4V to 5.5V Input, 4A/6A Step-Down Power Module with Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package

1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti

文件：3.09718 Mbytes 页数：43 Pages

TI

德州仪器

TPSM8286xA 2.4V to 5.5V Input, 4A/6A, Step-Down Power Module With Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package

1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti

文件：3.33733 Mbytes 页数：46 Pages

TI

德州仪器

丝印：T8866A；Package：QFN-FCMOD(RCF)；TPSM8286xA 2.4V to 5.5V Input, 4A/6A, Step-Down Power Module With Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package

1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti

文件：3.33733 Mbytes 页数：46 Pages

TI

德州仪器