首页 >TPSM82866A>规格书列表
| 型号 | 下载 订购 | 功能描述 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
TPSM82866A | TPSM8286xA 2.4V to 5.5V Input, 4A/6A Step-Down Power Module with Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package 1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti 文件：3.09718 Mbytes 页数：43 Pages | TI 德州仪器 | TI | |
TPSM82866A | TPSM82864A/TPSM82866A 2.4-V to 5.5-V Input, 4-A/6-A Step-Down Power Module with an Integrated Inductor in a 3.5-mm 횞 4.0-mm Thin Overmolded QFN Package 文件：3.09655 Mbytes 页数：34 Pages | TI 德州仪器 | TI | |
TPSM8286xA 2.4V to 5.5V Input, 4A/6A, Step-Down Power Module With Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package 1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti 文件：3.33733 Mbytes 页数：46 Pages | TI 德州仪器 | TI | ||
丝印：TM866AA0H；Package：B0QFN；TPSM8286xA 2.4V to 5.5V Input, 4A/6A Step-Down Power Module with Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package 1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti 文件：3.09718 Mbytes 页数：43 Pages | TI 德州仪器 | TI | ||
TPSM8286xA 2.4V to 5.5V Input, 4A/6A, Step-Down Power Module With Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package 1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti 文件：3.33733 Mbytes 页数：46 Pages | TI 德州仪器 | TI | ||
TPSM8286xA 2.4V to 5.5V Input, 4A/6A Step-Down Power Module with Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package 1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti 文件：3.09718 Mbytes 页数：43 Pages | TI 德州仪器 | TI | ||
丝印：T8866A；Package：QFN-FCMOD(RCF)；TPSM8286xA 2.4V to 5.5V Input, 4A/6A, Step-Down Power Module With Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package 1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti 文件：3.33733 Mbytes 页数：46 Pages | TI 德州仪器 | TI | ||
丝印：T8866A；Package：QFN-FCMOD(RCF)；TPSM8286xA 2.4V to 5.5V Input, 4A/6A, Step-Down Power Module With Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package 1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti 文件：3.33733 Mbytes 页数：46 Pages | TI 德州仪器 | TI | ||
丝印：T8866A；Package：QFN-FCMOD(RCF)；TPSM8286xA 2.4V to 5.5V Input, 4A/6A, Step-Down Power Module With Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package 1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti 文件：3.33733 Mbytes 页数：46 Pages | TI 德州仪器 | TI | ||
TPSM8286xA 2.4V to 5.5V Input, 4A/6A, Step-Down Power Module With Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package 1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti 文件：3.33733 Mbytes 页数：46 Pages | TI 德州仪器 | TI |
技术参数
- Vin (Min) (V)：
2.4
- Vin (Max) (V)：
5.5
- Vout (Min) (V)：
0.6
- Vout (Max) (V)：
5.5
- Soft start：
Fixed
- Features：
EMI Tested
- Operating temperature range (C)：
-40 to 125
- Iq (Typ) (uA)：
4
- Regulated outputs (#)：
1
- Switching frequency (Max) (kHz)：
2500
- Switching frequency (Min) (kHz)：
2200
- Duty cycle (Max) (%)：
100
- Topology：
Buck
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TI德州仪器 |
22+ |
24000 |
原装正品现货,实单可谈,量大价优 |
询价 | |||
TI |
25+ |
B0QFN (RDJ) |
6000 |
原厂原装,价格优势 |
询价 | ||
TI/德州仪器 |
22+ |
B0QFN23 |
9000 |
原装正品,支持实单! |
询价 | ||
TI |
24+ |
B0QFN23 |
10000 |
询价 | |||
ti |
21+ |
B0QFN23 |
3000 |
进口原装现货假一赔万力挺实单 |
询价 | ||
TI |
23+ |
B0QFN |
5000 |
全新原装正品现货 |
询价 | ||
TI(德州仪器) |
23+ |
标准封装 |
6000 |
正规渠道,只有原装! |
询价 | ||
TI/德州仪器 |
24+ |
B0QFN23 |
2888 |
见字如面 欣喜相逢 |
询价 | ||
TI/德州仪器 |
22+ |
B0QFN23 |
3500 |
原装正品 |
询价 | ||
TI |
25+ |
B0QFN23 |
6110 |
询价 |
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