首页 >TPS5211PWPR>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
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HighSpeedInfraredEmittingDiode,890nm,SurfaceEmitterTechnology DESCRIPTION TSHF5211isaninfrared,890nmemittingdiodeinsurface emitterchiptechnologywithhighradiantpowerandhigh speed,moldedinaclear,untintedplasticpackage. FEATURES •Packagetype:leaded •Packageform:T-1¾ •Dimensions(inmm):Ø5 •Leadswithstand-off •Peak | VishayVishay Siliconix 威世科技威世科技半导体 | Vishay | ||
HighSpeedInfraredEmittingDiode,890nm,SurfaceEmitterTechnology DESCRIPTION TSHF5211isaninfrared,890nmemittingdiodeinsurface emitterchiptechnologywithhighradiantpowerandhigh speed,moldedinaclear,untintedplasticpackage. FEATURES •Packagetype:leaded •Packageform:T-1¾ •Dimensions(inmm):Ø5 •Leadswithstand-off •Peak | VishayVishay Siliconix 威世科技威世科技半导体 | Vishay | ||
HighSpeedInfraredEmittingDiode,890nm,SurfaceEmitterTechnology DESCRIPTION TSHF5211isaninfrared,890nmemittingdiodeinsurface emitterchiptechnologywithhighradiantpowerandhigh speed,moldedinaclear,untintedplasticpackage. FEATURES •Packagetype:leaded •Packageform:T-1¾ •Dimensions(inmm):Ø5 •Leadswithstand-off •Peak | VishayVishay Siliconix 威世科技威世科技半导体 | Vishay | ||
HighSpeedInfraredEmittingDiode,890nm,SurfaceEmitterTechnology DESCRIPTION TSHF5211isaninfrared,890nmemittingdiodeinsurface emitterchiptechnologywithhighradiantpowerandhigh speed,moldedinaclear,untintedplasticpackage. FEATURES •Packagetype:leaded •Packageform:T-1¾ •Dimensions(inmm):Ø5 •Leadswithstand-off •Peak | VishayVishay Siliconix 威世科技威世科技半导体 | Vishay | ||
SiliconNPNepitaxialplanertransistor SiliconNPNepitaxialplanartype Fordigitalcircuits ■Features •Costscanbereducedthroughdownsizingoftheequipmentandreductionofthenumberofparts •S-Minitypepackage,allowingautomaticinsertionthroughthetapepackingandmagazinepacking | PanasonicPanasonic Semiconductor 松下松下电器 | Panasonic | ||
SiliconNPNepitaxialplanartype SiliconNPNepitaxialplanartype Fordigitalcircuits ■Features •Costscanbereducedthroughdownsizingoftheequipmentandreductionofthenumberofparts •S-Minitypepackage,allowingautomaticinsertionthroughthetapepackingandmagazinepacking | PanasonicPanasonic Semiconductor 松下松下电器 | Panasonic | ||
SiliconNPNepitaxialplanartype SiliconNPNepitaxialplanartype Fordigitalcircuits ■Features •Costscanbereducedthroughdownsizingoftheequipmentandreductionofthenumberofparts •S-Minitypepackage,allowingautomaticinsertionthroughthetapepackingandmagazinepacking | PanasonicPanasonic Semiconductor 松下松下电器 | Panasonic | ||
ElectricalSpecificationsat25oC ZenerDiodes ElectricalSpecificationsat25°C | AMMSEMIAmerican Microsemiconductor 美国微半导体有限公司 | AMMSEMI | ||
POWERZENERS DESCRIPTION Fused-in-glass,metallurgically-bonded5wattzeners. FEATURES •2TimesGreaterSurgeRatingthanConventional10WattZeners •SmallPhysicalSize | NJSEMINew Jersey Semi-Conductor Products, Inc. 新泽西半导体新泽西半导体产品股份有限公司 | NJSEMI | ||
POWERZENERS5WATT POWERZENERS5WATT AvailableNon-RoHS(standard)orRoHScompliant(addPBFsuffix). Availableas“HR”(highreliability)screenedperMIL-PRF-19500,JANTXlevel.Add“HR”suffixtobasepartnumber. | DIGITRON Digitron Semiconductors | DIGITRON |
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