TMP144传感器变送器的温度传感器-模拟数字输出规格书PDF中文资料

TMP144属于传感器变送器的温度传感器-模拟数字输出。由德州仪器制造生产的TMP144温度传感器 - 模拟和数字输出模拟和数字输出温度传感器可用于测量环境热能量。特征包括传感器类型、本地感测温度、远程感测温度、输出类型、电源电压和分辨率。传感器类型为模拟本地/远程/红外、模拟数字、本地/远程、数字本地/远程/红外或内部，感应温度范围为 -55°C 至 200°C。

1 Features

• Multiple Device Access (MDA):

– Global read/write operations

• SMAART Wire™ / UART interface

• Resolution: 12-bit or 0.0625°C

• ±1°C maximum (–10°C to +100°C)

• ±2°C maximum (–40°C to +125°C)

• Low quiescent current:

– 3-μA active IQ at 0.25 Hz

– 0.6-μA shutdown

• Supply range: 1.4 V to 3.6 V

• Push-pull digital output

• Package:

– 0.76 mm × 0.96 mm, 150-μm maximum height,

4-ball YMT (DSBGA)

– 0.76 mm × 0.96 mm, 310-μm maximum height,

4-ball YBK (DSBGA)

– 0.76 mm × 0.96 mm, 625-μm maximum height,

4-ball YFF (DSBGA)

2 Applications

• Handsets

• Smartphones

• Tablets

• LED Backlighting

• HDTVs

• Enterprise Servers

• Notebooks

• Medical

3 Description

The TMP144 digital output temperature sensor can

read temperatures to a resolution of 0.0625°C.

The device has a SMAART Wire™ / UART

interface that supports daisy-chain configurations. The

interface also supports Multiple Device Access (MDA)

commands that let the host communicate with multiple

devices on the bus simultaneously. MDA commands

are used as an alternative to sending individual

commands to each device on the bus. Up to 16

TMP144 devices can be attached together serially

and can be read by the host computer.

The TMP144 device is designed for spaceconstrained,

power-sensitive applications with multiple

temperature measurement zones that must be

monitored. The device is specified for operation over

a temperature range of –40°C to 125°C and is

available in three different 4-ball, low-height wafer

chip-scale package (DSBGA) options. The YMT

package of the device has a height of 150 μm, which

is 40 thinner than a 0201 resistor. The thinner

YMT package can be placed under heat-dissipating

components on the system for better accuracy and

faster thermal response times.