Telink BLE series SoC unlocks the full potential for Bluetooth low energy applications

General Description The TLSR8266/TLSR8266F512/TLSR8266F128/TLSR8266F1K is Telink-developed BLE SoC solution which is fully standard compliant and allows easy connectivity with Bluetooth Smart Ready mobile phones, tablets, laptops. Telink BLE SoC supports BLE slave and master mode operation, in

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Telink BLE series SoC unlocks the full potential for Bluetooth low energy applications

General Description The TLSR8266/TLSR8266F512/TLSR8266F128/TLSR8266F1K is Telink-developed BLE SoC solution which is fully standard compliant and allows easy connectivity with Bluetooth Smart Ready mobile phones, tablets, laptops. Telink BLE SoC supports BLE slave and master mode operation, in

文件：287.96 Kbytes 页数：3 Pages

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Telink BLE series SoC unlocks the full potential for Bluetooth low energy applications

General Description The TLSR8266/TLSR8266F512/TLSR8266F128/TLSR8266F1K is Telink-developed BLE SoC solution which is fully standard compliant and allows easy connectivity with Bluetooth Smart Ready mobile phones, tablets, laptops. Telink BLE SoC supports BLE slave and master mode operation, in

文件：287.96 Kbytes 页数：3 Pages

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Telink BLE series SoC unlocks the full potential for Bluetooth low energy applications

General Description The TLSR8266/TLSR8266F512/TLSR8266F128/TLSR8266F1K is Telink-developed BLE SoC solution which is fully standard compliant and allows easy connectivity with Bluetooth Smart Ready mobile phones, tablets, laptops. Telink BLE SoC supports BLE slave and master mode operation, in

文件：287.96 Kbytes 页数：3 Pages

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蓝牙低功耗芯片

TLSR8266/TLSR8266F512是泰凌开发的完全与标准兼容的BLE SoC，可以实现与蓝牙智慧连接（Bluetooth Smart Ready）手机、平板电脑、笔记本之间的便利连接。TLSR8266/TLSR8266F512支持BLE主从模式操作，包括广播、加密、连接更新与通道映射更新。\r\n TLSR8266/TLSR8266F512可提供高集成度、超低功耗的应用功能，在单片芯片上集成了强大的32位MCU，BLE/2.4G射频收发器，16KB SRAM，128/256/512KB外部FLASH（TLSR8266）或512KB内部FLASH（TLSR8266F512），14位 --- 单芯片方案\r\n■ 32位高性能MCU，时钟速度可高达48MHz\r\n■ 程序存储器：外部128/256/512KB FLASH（TLSR8266）或内部512KB FLASH （TLSR8266F512）\r\n■ 数据存储器：16KB片上SRAM\r\n■ 12M/16MHz&32.768KHz晶振，32KHz/32MHz嵌入RC振荡器\r\n■ 丰富的IO接口：\r\n◇ TLSR8266: 根据不同的封装，有多达41/37/22个GPIO\r\n◇ TLSR8266F512: 根据不同的封装，有多达35/20个GPIO\r\n◇ DMIC（数字Mic）\r\n◇ AMIC（;

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