TL16C752B-EP数据手册TI中文资料规格书

特性 Features

• Controlled Baseline
- One Assembly Site
• Test Site
• One Fabrication Site
• Extended Temperature Performance of\\ –55°C to 110°C and –40°C to 105°C
• Enhanced Diminishing Manufacturing Sources (DMS) Support
• Enhanced Product Change Notification
• Qualification Pedigree
• Pin Compatible With ST16C2550 With Additional Enhancements
• Up to 1.5-Mbps Baud Rate When Using Crystal (24-MHz Input Clock)
• Up to 3-Mbps Baud Rate When Using Oscillator or Clock Source (48-MHz Input Clock)
• 64-Byte Transmit FIFO
• 64-Byte Receive FIFO With Error Flags
• Programmable and Selectable Transmit and Receive FIFO Trigger Levels for DMA and Interrupt Generation
• Programmable Receive FIFO Trigger Levels for Software/Hardware Flow Control
• Software/Hardware Flow Control
- Programmable Xon/Xoff Characters
• Programmable Auto-RTS and Auto-CTS
• Optional Data Flow Resume by Xon Any Character
• DMA Signaling Capability for Both Received and Transmitted Data
• Supports 3.3-V Operation
• Software Selectable Baud Rate Generator
• Prescaler Provides Additional Divide By Four Function
• Fast Access Time 2 Clock Cycle IOR/IOW Pulse Width
• Programmable Sleep Mode
• Programmable Serial Interface Characteristics
- 5-Bit, 6-Bit, 7-Bit, or 8-Bit Characters
• Even, Odd, or No Parity Bit Generation and Detection
• 1, 1.5, or 2 Stop Bit Generation
• False Start Bit Detection
• Complete Status Reporting Capabilities in Both Normal and Sleep Mode
• Line Break Generation and Detection
• Internal Test and Loopback Capabilities
• Fully Prioritized Interrupt System Controls
• Modem Control Functions (CTS, RTS, DSR, DTR, RI, and CD)

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.