丝印：TIBPAL16R4-12MJ；Package：CDIP；HIGH-PERFORMANCE IMPACT-X™ PAL® CIRCUITS

High-Performance Operation: fmax (w/o feedback) TIBPAL16R’-10C Series . . . 62.5 MHz Min TIBPAL16R’-12M Series . . . 56 MHz Min fmax (with feedback) TIBPAL16R’-10C Series . . . 55.5 MHz Min TIBPAL16R’-12M Series . . . 48 MHz Min Propagation Delay TIBPAL16L’-10C Series . . . 10 ns Max TIBP

文件：931.74 Kbytes 页数：27 Pages

TI

德州仪器

丝印：5962-8515516RA；Package：CDIP；HIGH-PERFORMANCE IMPACT-X™ PAL® CIRCUITS

High-Performance Operation: fmax (w/o feedback) TIBPAL16R’-10C Series . . . 62.5 MHz Min TIBPAL16R’-12M Series . . . 56 MHz Min fmax (with feedback) TIBPAL16R’-10C Series . . . 55.5 MHz Min TIBPAL16R’-12M Series . . . 48 MHz Min Propagation Delay TIBPAL16L’-10C Series . . . 10 ns Max TIBP

文件：931.74 Kbytes 页数：27 Pages

TI

德州仪器

丝印：5962-8515516RA；Package：CDIP；HIGH-PERFORMANCE IMPACT-X™ PAL® CIRCUITS

High-Performance Operation: fmax (w/o feedback) TIBPAL16R’-10C Series . . . 62.5 MHz Min TIBPAL16R’-12M Series . . . 56 MHz Min fmax (with feedback) TIBPAL16R’-10C Series . . . 55.5 MHz Min TIBPAL16R’-12M Series . . . 48 MHz Min Propagation Delay TIBPAL16L’-10C Series . . . 10 ns Max TIBP

文件：931.74 Kbytes 页数：27 Pages

TI

德州仪器

HIGH-PERFORMANCE IMPACT™ PAL® CIRCUITS

High-Performance Operation: Propagation Delay . . . 15 ns Max Power-Up Clear on Registered Devices (All Register Outputs are Set High, but Voltage Levels at the Output Pins Go Low) Package Options Include Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) 300-mil DIPs D

文件：941.65 Kbytes 页数：19 Pages

TI

德州仪器

丝印：5962-85155122A；Package：LCCC；HIGH-PERFORMANCE IMPACT™ PAL® CIRCUITS

High-Performance Operation: Propagation Delay . . . 15 ns Max Power-Up Clear on Registered Devices (All Register Outputs are Set High, but Voltage Levels at the Output Pins Go Low) Package Options Include Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) 300-mil DIPs D

文件：941.65 Kbytes 页数：19 Pages

TI

德州仪器

丝印：5962-85155122A；Package：LCCC；HIGH-PERFORMANCE IMPACT™ PAL® CIRCUITS

High-Performance Operation: Propagation Delay . . . 15 ns Max Power-Up Clear on Registered Devices (All Register Outputs are Set High, but Voltage Levels at the Output Pins Go Low) Package Options Include Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) 300-mil DIPs D

文件：941.65 Kbytes 页数：19 Pages

TI

德州仪器

丝印：5962-8515512RA；Package：CDIP；HIGH-PERFORMANCE IMPACT™ PAL® CIRCUITS

High-Performance Operation: Propagation Delay . . . 15 ns Max Power-Up Clear on Registered Devices (All Register Outputs are Set High, but Voltage Levels at the Output Pins Go Low) Package Options Include Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) 300-mil DIPs D

文件：941.65 Kbytes 页数：19 Pages

TI

德州仪器

丝印：5962-8515512RA；Package：CDIP；HIGH-PERFORMANCE IMPACT™ PAL® CIRCUITS

High-Performance Operation: Propagation Delay . . . 15 ns Max Power-Up Clear on Registered Devices (All Register Outputs are Set High, but Voltage Levels at the Output Pins Go Low) Package Options Include Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) 300-mil DIPs D

文件：941.65 Kbytes 页数：19 Pages

TI

德州仪器

丝印：5962-8515512SA；Package：CFP；HIGH-PERFORMANCE IMPACT™ PAL® CIRCUITS

High-Performance Operation: Propagation Delay . . . 15 ns Max Power-Up Clear on Registered Devices (All Register Outputs are Set High, but Voltage Levels at the Output Pins Go Low) Package Options Include Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) 300-mil DIPs D

文件：941.65 Kbytes 页数：19 Pages

TI

德州仪器

丝印：5962-8515512SA；Package：CFP；HIGH-PERFORMANCE IMPACT™ PAL® CIRCUITS

High-Performance Operation: Propagation Delay . . . 15 ns Max Power-Up Clear on Registered Devices (All Register Outputs are Set High, but Voltage Levels at the Output Pins Go Low) Package Options Include Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) 300-mil DIPs D

文件：941.65 Kbytes 页数：19 Pages

TI

德州仪器