TIBPAL16R4-15MFKB.A规格书应用电路供应代理-114ic电子网

型号	下载订购	功能描述	制造商上传企业	LOGO
TIBPAL16R4-15MFKB.A	文件：941.65 Kbytes Page：19 Pages	丝印：5962-85155122A；Package：LCCC；HIGH-PERFORMANCE IMPACT™ PAL® CIRCUITS High-Performance Operation: Propagation Delay . . . 15 ns Max Power-Up Clear on Registered Devices (All Register Outputs are Set High, but Voltage Levels at the Output Pins Go Low) Package Options Include Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) 300-mil DIPs D 文件：941.65 Kbytes 页数：19 Pages	TI 德州仪器	TI
TIBPAL16R4-15MJ	文件：249.41 Kbytes Page：13 Pages	HIGH-PERFORMANCE IMPACT E PAL CIRCUITS 文件：249.41 Kbytes 页数：13 Pages	TI 德州仪器	TI
TIBPAL16R4-15MJB	文件：445.84 Kbytes Page：19 Pages	HIGH-PERFORMANCE IMPACT 文件：445.84 Kbytes 页数：19 Pages	TI 德州仪器	TI
TIBPAL16R4-15MJB	文件：941.65 Kbytes Page：19 Pages	HIGH-PERFORMANCE IMPACT™ PAL® CIRCUITS High-Performance Operation: Propagation Delay . . . 15 ns Max Power-Up Clear on Registered Devices (All Register Outputs are Set High, but Voltage Levels at the Output Pins Go Low) Package Options Include Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) 300-mil DIPs D 文件：941.65 Kbytes 页数：19 Pages	TI 德州仪器	TI

更多TIBPAL16R4-15MFKB.A供应商更新时间2025-10-6 10:34:00