Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide.

FEATURES Cutting-edge technology and expanding package offerings provide a platform from prototype-toproduction Copper (Cu) wire interconnect method and high-volume infrastructure at all Amkor CABGA production facilities Lowest cost using Amkor standard CABGA bill of materials selection 1.

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amkor

安靠科技

Single-chip 16-bit/32-bit ocontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC

General description The LPC2364/65/66/67/68 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S CPU with real-time emulation that combines the microcontroller with up to 512 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable

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恩XP

Single-chip 16-bit/32-bit ocontrollers; up to 512 kB flash with ISP/IAP, Ethernet, USB 2.0, CAN, and 10-bit ADC/DAC

General description The LPC2364/65/66/67/68 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S CPU with real-time emulation that combines the microcontroller with up to 512 kB of embedded high-speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable

文件：405.41 Kbytes 页数：69 Pages

恩XP

SAM9X75 System-in-Package (SiP) MPU with 1‑Gbit or 2‑Gbit DDR3L SDRAM

Features • CPU Running up to 800 MHz – ARM926EJ-S Arm Thumb® processor – 32-Kbyte data cache, 32-Kbyte instruction cache, Memory Management Unit (MMU) • Memories – One 176-Kbyte internal ROM • 80-Kbyte internal ROM embedding a secure bootloader program supporting boot on NAND Flash, SD Card

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Microchip

微芯科技

Arm® based dual Cortex®-A35 1.5 GHz Cortex®-M33 MPU, AI, 3D GPU, video encoder/decoder, TFT/DSI/LVDS, USB 3.0, PCIe®

Features Includes ST state-of-the-art patented technology. Cores • Up to 64-bit dual-core Arm® Cortex®-A35 – Up to 1.5 GHz – 32-Kbyte I + 32-Kbyte D level 1 cache for each core – 512-Kbyte unified level 2 cache – Arm® NEON™ and Arm® TrustZone® • 32-bit Arm® Cortex®-M33 with FPU/MPU – Up t

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STMICROELECTRONICS

意法半导体

32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet; two High-speed USBs; advanced configurable peripherals

文件：2.68645 Mbytes 页数：153 Pages

恩XP

32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller

文件：2.42477 Mbytes 页数：149 Pages

恩XP

32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller

文件：2.42477 Mbytes 页数：149 Pages

恩XP

32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet; two High-speed USBs; advanced configurable peripherals

文件：2.68645 Mbytes 页数：153 Pages

恩XP

32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet; two High-speed USBs; advanced configurable peripherals

恩XP

恩智浦