0.4mm Pitch, 0.65mm Height, Back-Flip Type, 1Row, Bottom Contact, FPC To Board CONNECTOR

文件：465.15 Kbytes 页数：6 Pages

HIROSEHirose Electric Company

广濑日本广濑电机株式会社

丝印：TF110P03M；Package：PDFNWB3.3x3.3-8L；P -CHANNEL ENHANCEMENT MODE POWER MOSFET

● General Description The TF110P03M combines advanced trench MOSFETtechnology with a low resistance package toprovideextremely low RDS(ON). ● Features Advance high cell density Trench technology Low RDS(ON) to minimize conductive loss Low Gate Charge for fast switching Low Thermal resistan

文件：2.62205 Mbytes 页数：5 Pages

TUOFENG

拓锋半导体

丝印：TF110P03N；Package：TF110P03NAYXXA；P -CHANNEL ENHANCEMENT MODE POWER MOSFET

● General Description The TF110P03N combines advanced trench MOSFETtechnology with a low resistance package toprovideextremely low RDS(ON). ● Features Advance high cell density Trench technology Low RDS(ON) to minimize conductive loss Low Gate Charge for fast switching Low Thermal resistan

文件：2.83123 Mbytes 页数：5 Pages

TUOFENG

拓锋半导体

SOLID STATE I/O INTERFACE MODULE (DC INPUT MODULE)

文件：134.55 Kbytes 页数：2 Pages

TOSHIBA

东芝

SOLID STATE I/O INTERFACE MODULE (DC INPUT MODULE)

文件：134.04 Kbytes 页数：2 Pages

TOSHIBA

东芝

SOLID STATE I/O INTERFACE MODULE (DC INPUT MODULE)

文件：164.19 Kbytes 页数：3 Pages

TOSHIBA

东芝

SOLID STATE I/O INTERFACE MODULE (DC INPUT MODULE)

文件：151.31 Kbytes 页数：3 Pages

TOSHIBA

东芝

0.4mm Pitch, 0.65mm Height, Back-Flip Type, 1Row, Bottom Contact, FPC To Board CONNECTOR

文件：465.15 Kbytes 页数：6 Pages

HIROSEHirose Electric Company

广濑日本广濑电机株式会社

Overture TM Audio Power Amplifier Series High-Performance 68W Audio Power Amplifier w/Mute

文件：846.44 Kbytes 页数：24 Pages

NSC

国半

Temperature probe according to DIN with thermowell

• Standard process adaptationwith G1/2” threaded connection\n• interchangeable terminal head\n• optional: calibrationcertificate with tracing evidence according to DIN ISO 9000 ff;

SELI

赛力康电气