首页 >TESST12V0AA>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
SMDESDProtectionDiode Features -Bi-directionalESDprotection. -Lowleakagecurrent. -Lowclampingvoltage. -UltrasmallSMDpackage:0201. -AEC-Q101Qualified. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -Bi-directionalESDprotection. -Lowleakagecurrent. -Lowclampingvoltage. -UltrasmallSMDpackage:0201. -AEC-Q101Qualified. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features Uni-directionalESDprotection IEC61000-4-215kV(contact),20kV(air). Workingvoltage:5V UltrasmallSMDpackage:0503. Highcomponentdensity. Mechanicaldata Case:0503(1308)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-STD-7 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode RoHSDevice HalogenFree Features -Uni-directionalESDprotection -UltrasmallSMDpackage:0503. -Highcomponentdensity. Mechanicaldata -Case:0503/SOD-523FStandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode:Cathode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -Uni-diretionalESDprotection. -Surfacemountpackage. -Highcomponentdensity. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode:Cathodeband&E12 -Mountingposition: | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode RoHSDevice HalogenFree Features -Uni-directionalESDprotection. -Surfacemountpackage. -Highcomponentdensity. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method2026. -MarkingCode:Cathodeband&am | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -Lowclampingvoltage. -LowLeakagecurrent. -ProtectsoneI/Oline. -Workingvoltages:3.3V~36V. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode -Workingvoltages:2.5V~15V. -Lowleakagecurrent. -ProtectsonedirectionalI/Oline. -Lowclampingvoltage. -IEC61000-4-2Level4ESDprotection. Features | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -IEC61000-4-2Level4ESDprotection. -ESDRatingofClass3(>16kV)perHumanBodyMode. -Lowbodyheight:0.017”(0.43mm) -LowLeakage Mechanicaldata -Epoxy:MeetsUL94V-0 -Case:0402/SOD-923Fsmalloutlineplasticpackage.moldedplastic. -Terminals:Mattetinplated,so | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDESDProtectionDiode Features -Bi-directionalESDprotection. -Lowleakagecurrent. -Lowclampingvoltage. -UltrasmallSMDpackage. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
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