Amkor’s PBGA/TEPBGA packages incorporate the most advanced assembly processes and designs for cost/performance applications.

Features Innovative designs and expanding package offerings provide a platform from prototype-to-production. Custom ball counts up to 1521 1.00, 1.27 & 1.50 mm standard ball pitch available (other ball pitches available upon request, e.g. 0.8 mm) 17 to 40 mm body sizes Thin Au wire or Cu

文件：790.66 Kbytes 页数：3 Pages

AMKOR

安靠科技

Amkor’s PBGA/TEPBGA packages incorporate the most advanced assembly processes and designs for cost/performance applications.

Features Innovative designs and expanding package offerings provide a platform from prototype-to-production. Custom ball counts up to 1521 1.00, 1.27 & 1.50 mm standard ball pitch available (other ball pitches available upon request, e.g. 0.8 mm) 17 to 40 mm body sizes Thin Au wire or Cu

文件：790.66 Kbytes 页数：3 Pages

AMKOR

安靠科技

Amkor’s PBGA/TEPBGA packages incorporate the most advanced assembly processes and designs for cost/performance applications.

Features Innovative designs and expanding package offerings provide a platform from prototype-to-production. Custom ball counts up to 1521 1.00, 1.27 & 1.50 mm standard ball pitch available (other ball pitches available upon request, e.g. 0.8 mm) 17 to 40 mm body sizes Thin Au wire or Cu

文件：790.66 Kbytes 页数：3 Pages

AMKOR

安靠科技

Amkor’s PBGA/TEPBGA packages incorporate the most advanced assembly processes and designs for cost/performance applications.

Features Innovative designs and expanding package offerings provide a platform from prototype-to-production. Custom ball counts up to 1521 1.00, 1.27 & 1.50 mm standard ball pitch available (other ball pitches available upon request, e.g. 0.8 mm) 17 to 40 mm body sizes Thin Au wire or Cu

文件：790.66 Kbytes 页数：3 Pages

AMKOR

安靠科技