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TESVFB21V105M8R	文件：142.58 Kbytes Page：16 Pages	SurfacemountresinmoldedchipwithBuilt-infuse,Lowblow-outcurrent(2A) SurfacemountresinmoldedchipwithBuilt-infuse,Lowblow-outcurrent(2A) TheSV/Fseriesfeaturesabuilt-infusetominimizecircuitdamagefromovercurrentbyprotectionwithlessthanahalfblow-outcurrentoftheformertype. Thisfuse-protectedcapacitorissuitablefornoiseabsorpt	NECRenesas Electronics America 瑞萨日本瑞萨电子株式会社	NEC
TESVHB21V105M8R	文件：104.76 Kbytes Page：20 Pages	SURFACEMOUNTRESINMOLDEDTANTALUMCHIPCAPACITORSHIGHRELIABILITY NEC’sSV/Hseriessolidtantalumcapacitorhasdevelopedforautomotiveapplication.Comparingtotheformertype(RSeries),thehigherreliabilityandthehigherperformancehavebeenbuiltinthesamechipsizewiththeNEC’soriginaltechnologies. FEATURES TheSV/Hserieshastheh	NECRenesas Electronics America 瑞萨日本瑞萨电子株式会社	NEC

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制造商上传企业

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TESVFB21V105M8R

文件：142.58 Kbytes

Page：16 Pages

SurfacemountresinmoldedchipwithBuilt-infuse,Lowblow-outcurrent(2A)

SurfacemountresinmoldedchipwithBuilt-infuse,Lowblow-outcurrent(2A) TheSV/Fseriesfeaturesabuilt-infusetominimizecircuitdamagefromovercurrentbyprotectionwithlessthanahalfblow-outcurrentoftheformertype. Thisfuse-protectedcapacitorissuitablefornoiseabsorpt

NECRenesas Electronics America

瑞萨日本瑞萨电子株式会社

NEC

TESVHB21V105M8R

文件：104.76 Kbytes

Page：20 Pages

SURFACEMOUNTRESINMOLDEDTANTALUMCHIPCAPACITORSHIGHRELIABILITY

NEC’sSV/Hseriessolidtantalumcapacitorhasdevelopedforautomotiveapplication.Comparingtotheformertype(RSeries),thehigherreliabilityandthehigherperformancehavebeenbuiltinthesamechipsizewiththeNEC’soriginaltechnologies. FEATURES TheSV/Hserieshastheh

NECRenesas Electronics America

瑞萨日本瑞萨电子株式会社

NEC

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