首页 >TCBZX55B2V0>规格书列表

零件编号下载 订购功能描述/丝印制造商 上传企业LOGO

BZM55B2V0

Zenerdiode

Features 1.Savingspace 2.FitsontoSOD323/SOT23footprints 3.MicroMelfpackage Applications Voltagestabilization

WINNERJOINSHENZHEN YONGERJIA INDUSTRY CO.,LTD

永而佳深圳市永而佳实业有限公司

BZT55B2V0

0.5WattsHermeticallySealedGlassZenerVoltageRegulators

Features ◇Zenervoltagerange2.0to75volts ◇Mini-MELFpackage ◇Surfacedevicetypemounting ◇Hermeticallysealedglass ◇CompressionBondedConstruction ◇Allexternalsurfacesarecorrosionresistantandterminalsarereadilysolderable ◇RoHScompliant ◇MatteTin(Sn)leadfinish

TSCTaiwan Semiconductor Company, Ltd

台湾半导体台湾半导体股份有限公司

BZV55B2V0

ZENERDIODES

Features LowReverseLeakage LowZenerImpedance PowerDissipationof500mW HighStabilityandHighReliability

SYChangzhou Shunye Electronics Co.,Ltd.

顺烨电子江苏顺烨电子有限公司

BZV55B2V0

500mW.HermeticallySealedGlassZenerVoltageRectifiers

Features ◇Zenervoltagerange2.0to75volts ◇LL-34(Mini-MELF)package ◇Surfacedevicetypemounting ◇Hermeticallysealedglass ◇CompressionBondedConstruction ◇Allexternalsurfacesarecorrosionresistantandterminalsarereadilysolderable ◇RoHScompliant ◇MatteTin(Sn)lead

LUGUANGShenzhen Luguang Electronic Technology Co., Ltd

鲁光电子深圳市鲁光电子科技有限公司

BZV55B2V0

0.5WattsHermeticallySealedGlassZenerVoltageRegulators

Features ◇Zenervoltagerange2.0to75volts ◇LL-34(Mini-MELF)package ◇Surfacedevicetypemounting ◇Hermeticallysealedglass ◇CompressionBondedConstruction ◇Allexternalsurfacesarecorrosionresistantandterminalsarereadilysolderable ◇RoHScompliant ◇MatteTin(Sn)lead

TSCTaiwan Semiconductor Company, Ltd

台湾半导体台湾半导体股份有限公司

BZX55B2V0

SILICONZENERDIODES

FEATURES: *Complete2.0to100Volts *Highsurgecurrentcapability *Highpeakreversepowerdissipation *Highreliability *Lowleakagecurrent *ZenerVoltagetoleranceis±2 *Pb/RoHSFree

EIC

EIC discrete Semiconductors

ECCZD55B2V0

500mWSurfaceMountZenerDiodes-2.0V-100V

E-CMOSE-CMOS Corporation

飞虹高科飞虹高科股份有限公司

TCBZT55B2V0

500mWQUADROMini-MELFHermeticallySealedGlassZenerVoltageRegulators

SpecificationFeatures: ▪ZenerVoltageRange2.0to75Volts ▪Quadromini-MELFPackage ▪SurfaceDeviceTypeMounting ▪HermeticallySealedGlass ▪CompressionBondedConstruction ▪AllExternalSurfacesAreCorrosionResistantAndTermianlsarereadilysolderable ▪RoHSCompliant ▪Matt

TAK_CHEONGTak Cheong Electronics (Holdings) Co.,Ltd

德昌电子德昌电子(集团)有限公司

供应商型号品牌批号封装库存备注价格