STM32MP157A

ST STM32MP15x, DDR3L, STPMIC1A,4KB EEPROM, Oscillator and passive components integrated into a single package

Features •STSTM32MP15x,DDR3L,STPMIC1A,4KBEEPROM,Oscillatorandpassivecomponentsintegratedintoasinglepackage •STM32MP15xFeatures: oArm®Cortex®-A7upto800MHzx2 oArm®Cortex®-M4upto209MHz oNEON™SIMDCoprocessorx2 oArm®TrustZone® oUSB2.0HS+PHYx2 oEthernet10

STM32MP157C

ST STM32MP15x, DDR3L, STPMIC1A,4KB EEPROM, Oscillator and passive components integrated into a single package

Features •STSTM32MP15x,DDR3L,STPMIC1A,4KBEEPROM,Oscillatorandpassivecomponentsintegratedintoasinglepackage •STM32MP15xFeatures: oArm®Cortex®-A7upto800MHzx2 oArm®Cortex®-M4upto209MHz oNEON™SIMDCoprocessorx2 oArm®TrustZone® oUSB2.0HS+PHYx2 oEthernet10

STM32MP157D

ST STM32MP15x, DDR3L, STPMIC1A,4KB EEPROM, Oscillator and passive components integrated into a single package

Features •STSTM32MP15x,DDR3L,STPMIC1A,4KBEEPROM,Oscillatorandpassivecomponentsintegratedintoasinglepackage •STM32MP15xFeatures: oArm®Cortex®-A7upto800MHzx2 oArm®Cortex®-M4upto209MHz oNEON™SIMDCoprocessorx2 oArm®TrustZone® oUSB2.0HS+PHYx2 oEthernet10

STM32MP157DAC1

Discovery kits with increased-frequency 800 MHz STM32MP157 MPUs

Features •Commonfeatures: –STM32MP157Arm®-baseddualCortex®‑A7800MHz32bits+ Cortex®‑M432bitsMPUinaTFBGA361package –STPMICSTPMIC1 –4-GbitDDR3L,16bits,533MHz –1-Gbit/sEthernet(RGMII)compliantwithIEEE-802.3ab –USBOTGHS –Audiocodec –4userLEDs –2user

STM32MP157D-DK1

Discovery kits with increased-frequency 800 MHz STM32MP157 MPUs

Features •Commonfeatures: –STM32MP157Arm®-baseddualCortex®‑A7800MHz32bits+ Cortex®‑M432bitsMPUinaTFBGA361package –STPMICSTPMIC1 –4-GbitDDR3L,16bits,533MHz –1-Gbit/sEthernet(RGMII)compliantwithIEEE-802.3ab –USBOTGHS –Audiocodec –4userLEDs –2user

STM32MP157F

ST STM32MP15x, DDR3L, STPMIC1A,4KB EEPROM, Oscillator and passive components integrated into a single package

Features •STSTM32MP15x,DDR3L,STPMIC1A,4KBEEPROM,Oscillatorandpassivecomponentsintegratedintoasinglepackage •STM32MP15xFeatures: oArm®Cortex®-A7upto800MHzx2 oArm®Cortex®-M4upto209MHz oNEON™SIMDCoprocessorx2 oArm®TrustZone® oUSB2.0HS+PHYx2 oEthernet10

STM32MP157FAC1

Discovery kits with increased-frequency 800 MHz STM32MP157 MPUs

Features •Commonfeatures: –STM32MP157Arm®-baseddualCortex®‑A7800MHz32bits+ Cortex®‑M432bitsMPUinaTFBGA361package –STPMICSTPMIC1 –4-GbitDDR3L,16bits,533MHz –1-Gbit/sEthernet(RGMII)compliantwithIEEE-802.3ab –USBOTGHS –Audiocodec –4userLEDs –2user

STM32MP157FDK2

GNSS and inertial sensors expansion board for STM32 MPU

Features •Teseo-LIV3FLGNSSReceiver •OnboardiNEMOinertialmoduleforaccelerometerandgyroscope •QVARembeddedpressuresensorforaltitudemeasurement •Magnetometerforpositionaccuracy •LEDsforPPS,power,user •Keysforreset,wakeupanduser •ExternalLNA(LowNoiseAmplif

STM32MP157FDK2

STM32MP expansion board for NFC card reader

Features •ST25R3916BNFCcardreaderIC •47x34mm,fourturns,13.56MHzinductiveantennaetchedonPCBand associatedtuningcircuit •6generalpurposeLEDsand1Keyforuserinterface •EEPROMforautomaticGPIOsetupanddriversetup •CompatiblewithSTM32MP157F-DK2,STM32MP135F-D

STM32MP157F-DK2

Discovery kits with increased-frequency 800 MHz STM32MP157 MPUs

Features •Commonfeatures: –STM32MP157Arm®-baseddualCortex®‑A7800MHz32bits+ Cortex®‑M432bitsMPUinaTFBGA361package –STPMICSTPMIC1 –4-GbitDDR3L,16bits,533MHz –1-Gbit/sEthernet(RGMII)compliantwithIEEE-802.3ab –USBOTGHS –Audiocodec –4userLEDs –2user