XL-density performance line ARM-based 32-bit MCU with 768 KB to 1 MB Flash, USB

文件：2.55293 Mbytes 页数：120 Pages

STMICROELECTRONICS

意法半导体

XL-density performance line ARM-based 32-bit MCU

文件：2.55293 Mbytes 页数：120 Pages

STMICROELECTRONICS

意法半导体

XL-density performance line ARM-based 32-bit MCU

文件：2.55293 Mbytes 页数：120 Pages

STMICROELECTRONICS

意法半导体

XL-density performance line ARM-based 32-bit MCU with 768 KB to 1 MB Flash, USB, CAN, 17 timers, 3 ADCs, 13 communication interfaces

文件：2.55293 Mbytes 页数：120 Pages

STMICROELECTRONICS

意法半导体

主流增强型ARM Cortex-M3 MCU，具有16 KB Flash、72 MHz CPU、电机控制、USB和CAN

The STM32F103x4 and STM32F103x6 performance line family incorporates the high-performance ARM® Cortex™-M3 32-bit RISC core operating at a 72 MHz frequency, high-speed embedded memories (Flash memory up to 32 Kbytes and SRAM up to 6 Kbytes), and an extensive range of enhanced I/Os and peripherals con • ARM 32-bit Cortex™-M3 CPU Core \n •72 MHz maximum frequency,1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access \n •Single-cycle multiplication and hardware division \n• Memories \n •16 or 32 Kbytes of Flash memory \n •6 or 10 Kbytes of SRAM \n• Clock, reset and supply managem;

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意法半导体

主流增强型ARM Cortex-M3 MCU，具有32 KB Flash、72 MHz CPU、电机控制、USB和CAN

The STM32F103x4 and STM32F103x6 performance line family incorporates the high-performance ARM® Cortex™-M3 32-bit RISC core operating at a 72 MHz frequency, high-speed embedded memories (Flash memory up to 32 Kbytes and SRAM up to 6 Kbytes), and an extensive range of enhanced I/Os and peripherals con • ARM 32-bit Cortex™-M3 CPU Core \n •72 MHz maximum frequency,1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access \n •Single-cycle multiplication and hardware division \n• Memories \n •16 or 32 Kbytes of Flash memory \n •6 or 10 Kbytes of SRAM \n• Clock, reset and supply managem;

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意法半导体

主流高性能系列，Arm Cortex-M3 MCU，具有64 KB Flash存储器，72MHz CPU，电机控制，USB和CAN

STM32F103xx中等容量高性能系列，集成了工作频率为72 MHz的高性能Arm® Cortex®-M3 32位RISC内核、高速嵌入式存储器(高达128KB的Flash存储器和20KB的SRAM存储器)，以及大量连接至2条APB总线的增强型I/O与外设。所有器件均提供2个12位ADC、3个16位通用定时器、2个PWM定时器以及标准和高级通信接口：多达2个I2C和SPI、3个USART、1个USB和1个CAN。\n\n 器件的工作电压为2.0 V到3.6 V。工作温度范围为-40到+85 °C，可扩展至-40到+105 °C。这些器件均提供一组全面的节能模式，支持用户实现低功耗应用设计。\ • Arm®32位Cortex®-M3 CPU内核 \n •最大频率72 MHz，以零等待周期访问存储器时的性能达1.25 DMIPS/MHz (Dhrystone 2.1) \n •单周期乘法和硬件除法指令 \n• 存储器 \n •64到128 KB Flash \n •20 KB SRAM \n• 时钟、复位和电源管理 \n •2.0 V到3.6 V应用电源和I/O \n •上电复位 (POR)、掉电复位 (PDR) 和可编程电压检测器 (PVD) \n •4至16 MHz晶振 \n •内置经工厂调校的8 MHz RC振荡器 \n •内置40 kHz RC振荡器 \n •用于CPU时钟的P;

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意法半导体