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首页>STIPN2M50T-H>芯片详情
STIPN2M50T-H 分立半导体产品功率驱动器模块 STMICROELECTRONICS/意法半导体
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原厂料号:STIPN2M50T-H品牌:ST(意法半导体)
原厂订货渠道,支持BOM配单一站式服务
STIPN2M50T-H是分立半导体产品 > 功率驱动器模块。制造商ST(意法半导体)/STMicroelectronics生产封装DIP-26/26-PowerDIP 模块(0.846",21.48mm)的STIPN2M50T-H功率驱动器模块功率驱动器模块为电源组件(通常为半桥或单相、两相或三相配置的 IGBT 和 MOSFET)提供物理防护。功率半导体或裸片将焊接或烧结在基材上,后者可承载功率半导体并在需要时提供电和热触点以及电绝缘。功率模块提供更高的功率密度,并且在许多情况下更可靠且更易于冷却。
产品属性
更多- 类型
描述
- 型号
:STIPN2M50T-H
- Package
:NDIP-26L
- Breakdown Voltage_max(V)
:500
- Drain Current (Dc)_max(A)
:2
- Current Rating_max
:4
- RDS(on)_max(Ω)
:1.7
- Switching Frequency_max(kHz)
:20
- PTOT_nom(W)
:10.4
- Topology
:3-phase inverter
- Substrate Material
:Full Molded
- Embedded power switches
:MOSFETs
- Logical Function
:Positive inputs
- Other Features
:Built-in NTC
- Protection Option Type
:Undervoltage lockout
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