SST34HF1681J中文资料SST数据手册PDF规格书

PRODUCT DESCRIPTION

The SST34HF16x1J ComboMemory devices integrate either a 1M x16 or 2M x8 CMOS flash memory bank with either a 256K x16, or 512K x16 CMOS pseudo SRAM (PSRAM) memory bank in a multi-chip package (MCP).

FEATURES:

• Flash Organization: 1M x16 or 2M x8

• Dual-Bank Architecture for Concurrent Read/Write Operation

– Bottom Sector Protection

– 16 Mbit: 12 Mbit + 4 Mbit

• PSRAM Organization:

– 4 Mbit: 256K x16

– 8 Mbit: 512K x16

• Single 2.7-3.3V Read and Write Operations

• Superior Reliability

– Endurance: 100,000 Cycles (typical)

– Greater than 100 years Data Retention

• Low Power Consumption:

– Active Current: 25 mA (typical)

– PSRAM Standby Current: 40 µA (typical)

• Hardware Sector Protection (WP#)

– Protects 4 outer most sectors (4 KWord) in the larger bank by holding WP# low and unprotects by holding WP# high

• Hardware Reset Pin (RST#)

– Resets the internal state machine to reading data array

• Byte Selection for Flash (CIOF pin)

– Selects 8-bit or 16-bit mode (56-ball package only)

• Sector-Erase Capability

– Uniform 2 KWord sectors

• Block-Erase Capability

– Uniform 32 KWord blocks

• Read Access Time

– Flash: 70 ns

– PSRAM: 70 ns

• Erase-Suspend / Erase-Resume Capabilities

• Security ID Feature

– SST: 128 bits

– User: 128 bits

• Latched Address and Data

• Fast Erase and Program (typical):

– Sector-Erase Time: 18 ms

– Block-Erase Time: 18 ms

– Chip-Erase Time: 35 ms

– Program Time: 7 µs

• Automatic Write Timing

– Internal VPP Generation

• End-of-Write Detection

– Toggle Bit

– Data# Polling

– Ready/Busy# pin

• CMOS I/O Compatibility

• JEDEC Standard Command Set

• Packages Available

– 56-ball LFBGA (8mm x 10mm)

– 62-ball LFBGA (8mm x 10mm)

• All non-Pb (lead-free) devices are RoHS compliant