SSOP (Shrink Small-Outline Package) and QSOP (Quarter-Size Small Outline Package) are leadframe based, plastic encapsulated packages

FEATURES Cu wire interconnect for low cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options Green materials are standard – Pb-free and RoHS compliant Stealth dicing (narrow saw streets) Larger/Higher density leadframe

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AMKOR

安靠科技

TO-220

SUPER超致

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SOP

DDC

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TO-220

仙童

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继电器

THE

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