RS-232/RS-422 Line Drivers/Receivers

DESCRIPTION… The SP301and SP302are proprietary single-chip devices that contain both RS-232 and RS-422 protocol line drivers and receivers. Their configuration may be changed at any time by logic levels on two control lines. In any configuration, both the SP301and SP302fully meet the requ

文件：186.8 Kbytes 页数：18 Pages

Sipex

12-Bit, 12MHz CCD/CIS SIGNAL PROCESSOR

文件：199.27 Kbytes 页数：16 Pages

BURR-BROWN

12-Bit, 12MHz CCD/CIS SIGNAL PROCESSOR

DESCRIPTION\nThe VSP3010 is a complete, three-channel image signal processor for Charge Coupled Device (CCD) or Contact Image Sensor (CIS) systems. Each channel contains sensor signal sampling, Black Level adjustment and a programmable gain amplifier.FEATURES\n●12-BIT, 12MHz A/D CONVERTER\n●GUARANTE ●12-BIT, 12MHz A/D CONVERTER\n●GUARANTEED NO MISSING CODES\n●3-CHANNEL, 4MHz COLOR SCAN MODE:\n    Correlated Double Samplers\n    8-Bit Offset Adjustment DACs\n    0dB to +13dB PGAs\n●A/D INPUT MONITOR\n●INTERNAL VOLTAGE REFERENCE\n●SINGLE +5V SUPPLY\n●3V OR 5V DIGITAL OUTPUT\n●LOW POWER: 500mW typ;

TI

德州仪器

Ultra-Low Capacitance Diode Array for ESD Protection

Description The SP3010 integrates 4 channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust device can safely absorb repetitive ESD strikes at the

文件：267.93 Kbytes 页数：5 Pages

Littelfuse

力特

Ultra-Low Capacitance Diode Array for ESD Protection

Description The SP3010 integrates 4 channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust device can safely absorb repetitive ESD strikes at the

文件：267.93 Kbytes 页数：5 Pages

Littelfuse

力特

30.0AMP Schottky Barrier Rectifiers

FEATURES * Low forward voltage drop * High current capability * High reliability * High surge current capability * Epitaxial construction MECHANICAL DATA * Case: Molded plastic * Epoxy: UL 94V-0 rate flame retardant * Lead: Lead solderable per MIL-STD-202, method 208 guaranteed * Pol

文件：287.67 Kbytes 页数：2 Pages

SECOS

喜可士

Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection

Description The SP3011 integrates six channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for USB 3.0 ports that may experience destructive electrostatic discharges (ESD). This high density array can safely absorb repetitive ESD strikes at t

文件：265.58 Kbytes 页数：6 Pages

Littelfuse

力特

Ultra-Low Capacitance Diode Array for USB 3.0 ESD Protection

Description The SP3011 integrates six channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for USB 3.0 ports that may experience destructive electrostatic discharges (ESD). This high density array can safely absorb repetitive ESD strikes at t

文件：265.58 Kbytes 页数：6 Pages

Littelfuse

力特

SP3012 Series 0.5pF Rail Clamp Array

Description The SP3012 integrates either 4 or 6 channels of ultra low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust devices can safely absorb repetitive ES

文件：805.13 Kbytes 页数：4 Pages

Littelfuse

力特

丝印：117XY；Package：DFN2510P10；ULTRA LOW CAPACITANCE TV S DIODE ARRAY

Features Ultra low capacitance: 0.3pF typical (I/O to I/O) Ultra low leakage: nA level Operating voltage: 5V Low clamping voltage Up to four lines protects Leadless flow-through package Complies with following standards: – IEC 61000-4-2 (ESD) immunity test Air discharge: ±15kV Contact di

文件：1.34148 Mbytes 页数：7 Pages

LEIDITECH

雷卯电子