Development Board for COM Express® Type 6/10 Pin-Out Modules

Features ƒ PICMG COM R3.0 Type6 & Type10 pinout compatible ƒ COM ExpressR Basic/ Compact/ Mini module ƒ HDMI/DP, LVDS/eDP, VGA ƒ I/O Expansion: A2: PCIe Gen4 slot, USB3.2 Gen2 A1: PCIe Gen3 slot, USB3.2 Gen2 ƒ Visible Debug Utility: BIOS Port 80 and Power State

文件：1.54775 Mbytes 页数：3 Pages

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Development Board for COM Express® R3.0 Type 6 / 10

Advantech

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9th/8thGen Intel® Xeon®/Core™ Processors COM Express Basic Module Type 6

Features ƒ Intel 9th/8th Gen Xeon®/Core™ Hexa/Quad Cores + PCH QM370/CM246 ƒ Dual channel DDR4, Max 96GB (ECC optional) ƒ High Speed I/O: 4 USB3.1 (Gen2), 8 PCIex1(Gen3), 4 SATA (Gen3) ƒ Three Independent Symmertrical Displays (Up to 4K) ƒ Supports iManager, WISE-Device-On, Embedded Software

文件：531.93 Kbytes 页数：3 Pages

ADVANTECH

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Development Board for COM Express® Type 6/10 Pin-Out Modules

Features ƒ PICMG COM R3.0 Type6 & Type10 pinout compatible ƒ COM ExpressR Basic/ Compact/ Mini module ƒ HDMI/DP, LVDS/eDP, VGA ƒ I/O Expansion: A2: PCIe Gen4 slot, USB3.2 Gen2 A1: PCIe Gen3 slot, USB3.2 Gen2 ƒ Visible Debug Utility: BIOS Port 80 and Power State

文件：1.54775 Mbytes 页数：3 Pages

ADVANTECH

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Intel® 11th Gen Core Processors (Code Name: Tiger Lake-H) (Code Name: Tiger Lake-H)

Features ƒ Intel® 11th Gen Core Processors, up to 8Core/16T, L3 Cache 24M ƒ Intel Iris Xe(Gen 12) graphics, 4 independent 4K display ƒ Dual channel DDR4 Max 128GB SODIMM, support ECC ƒ Super speed I/O: PCIe4 x16 (16GT/s), USB3.2 gen3 (10Gb), 2.5GbE, SATA3 (6Gb) ƒ TPM2.0 security protection,

文件：469.03 Kbytes 页数：2 Pages

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Intel® Pentium®/Celeron® and Atom® x6000 Series Processors (Code Name: Elkhart Lake) COM Express® Compact Type6

Features ƒ COM Express® R3.0 Compact Module Type 6 Pinout ƒ Intel® Pentium®/Celeron® and Atom® x6000 Series (Elkhart Lake) Processors ƒ Dual Channel up to 32GB DDR4-3200 and IBECC Supported by Specific SKUs ƒ Supports up to 3 simultaneous display: LVDS/eDP, HDMI/DisplayPort ƒ Supports onboar

文件：1.24826 Mbytes 页数：6 Pages

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AMD Embedded Ryzen V2000 COM Express® Compact Type 6

Features ƒ AMD Embedded Ryzen 7nm SoC – V2000 APU ƒ COM Express® R3.0 Compact Module Type 6 Pinout ƒ Dual Channel DDR4 SODIMM, max. 64GB (Both ECC & Non-ECC) ƒ High Speed I/Os: 2 USB 3.2 Gen2, 1 PCIe x8 Gen3, 8 PCIe x1 Gen3, and 2 SATA3.0 ƒ Four Display (DP++, HDMI, VGA, LVDS) ƒ Supports iM

文件：4.18813 Mbytes 页数：6 Pages

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11th Gen. Intel® Core™ Processor U-Series (Code Name: Tiger Lake-UP3) COM Express® Compact Type6

Features ƒ 11th Gen. Intel® Core™ Processor U-Series ƒ COM Express R3.0 Compact Module Type 6 Pinout ƒ Dual channel with one memory down and one SO-DIMM ƒ High speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ƒ Onboard NVMe x4 SSD up to 64GB, TPM2.0 (Optional) ƒ Supports SUSI, Device

文件：4.1535 Mbytes 页数：6 Pages

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Intel® Pentium®/Celeron® and Atom® x6000 Series Processors (Code Name: Elkhart Lake) COM Express® Mini Type10

Features ƒ COM Express® R3.0 Mini Module Type 10 Pinout ƒ Intel® Pentium®/Celeron® and Atom® x6000 Series (Elkhart Lake) Processors ƒ Dual Channel up to 16GB LPDDR4 3200MT/s and IBECC supported by specific SKUs ƒ Supports onboard eMMC storage(option) and 2.5GbE ƒ Supports iManager, WISE-Devi

文件：468.13 Kbytes 页数：2 Pages

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Development Board for COM Express® Type 6/10 Pin-Out Modules

Features ƒ PICMG COM R3.0 Type6 & Type10 pinout compatible ƒ COM ExpressR Basic/ Compact/ Mini module ƒ HDMI/DP, LVDS/eDP, VGA ƒ I/O Expansion: A2: PCIe Gen4 slot, USB3.2 Gen2 A1: PCIe Gen3 slot, USB3.2 Gen2 ƒ Visible Debug Utility: BIOS Port 80 and Power State

文件：1.54775 Mbytes 页数：3 Pages

ADVANTECH

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