SN74LVC245A-EP数据手册TI中文资料规格书

描述 Description

This octal bus transceiver is designed for 1.65-V to 3.6-V VCC operation.
The SN74LVC245A is designed for asynchronous communication between data buses. The device transmits data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE\\) input can be used to disable the device so the buses are effectively isolated.
To ensure the high-impedance state during power up or power down, OE\\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

特性 Features

• Controlled Baseline
- One Assembly/Test Site, One Fabrication Site
• Enhanced Diminishing Manufacturing Sources (DMS) Support
• Enhanced Product-Change Notification
• Qualification Pedigree
• Operates From 1.65 V to 3.6 V
• Inputs Accept Voltages to 5.5 V
• Max tpd of 6.3 ns at 3.3 V
• Typical VOLP (Output Ground Bounce) CC = 3.3 V, TA = 25°C
• Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C
• Ioff Supports Partial-Power-Down Mode Operation
• Supports Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC)
• Latch-Up Performance Exceeds 250 mA Per JESD 17
• ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
• 1000-V Charged-Device Model (C101)

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.