SN74GTLPH16945集成电路（IC）的转换器电平移位器规格书PDF中文资料

SN74GTLPH16945属于集成电路（IC）的转换器电平移位器。由德州仪器制造生产的SN74GTLPH16945转换器，电平移位器逻辑转换器或电平移位器 IC 可用于在数字逻辑设备之间传递信息，这些设备可在不同/不兼容的供电电压下工作，或可实现不同的信令方式。例如，可以将需要 5 V 电源的数字输出传感器连接到具有 3.3 V I/O 电源的 FPGA，或者在 CMOS 或 TTL 等单端信令方式与 PECL 或 LVDS 等差分技术之间进行转换。

FEATURES

· Member of the Texas Instruments Widebus™

Family

· TI-OPC™ Circuitry Limits Ringing on

Unevenly Loaded Backplanes

· OEC™ Circuitry Improves Signal Integrity and

Reduces Electromagnetic Interference

· Bidirectional Interface Between GTLP Signal

Levels and LVTTL Logic Levels

· LVTTL Interfaces Are 5-V Tolerant

· Medium-Drive GTLP Outputs (50 mA)

· LVTTL Outputs (–24 mA/24 mA)

· GTLP Rise and Fall Times Designed for

Optimal Data-Transfer Rate and Signal

Integrity in Distributed Loads

· Ioff, Power-Up 3-State, and BIAS VCC Support

Live Insertion

· Bus Hold on A-Port Data Inputs

· Distributed VCC and GND Pins Minimize

High-Speed Switching Noise

· Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

DESCRIPTION/ORDERING INFORMATION

The SN74GTLPH16945 is a medium-drive, 16-bit bus transceiver that provides LVTTL-to-GTLP and

GTLP-to-LVTTL signal-level translation. It is partitioned as two 8-bit transceivers. The device provides a

high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal

levels. High-speed (about three times faster than standard TTL or LVTTL) backplane operation is a direct result

of GTLP's reduced output swing (<1 V), reduced input threshold levels, improved differential input, OEC™

circuitry, and TI-OPC™ circuitry. Improved GTLP OEC and TI-OPC circuits minimize bus-settling time and have

been designed and tested using several backplane models. The medium drive allows incident-wave switching in

heavily loaded backplanes with equivalent load impedance down to 19 W.

GTLP is the Texas Instruments (TI™) derivative of the Gunning Transceiver Logic (GTL) JEDEC standard

JESD 8-3. The ac specification of the SN74GTLPH16945 is given only at the preferred higher noise margin

GTLP, but the user has the flexibility of using this device at either GTL (VTT = 1.2 V and VREF = 0.8 V) or GTLP

(VTT = 1.5 V and VREF = 1 V) signal levels.

Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels,

but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREF is the B-port differential input

reference voltage.

This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioff

circuitry disables the outputs, preventing damaging current backflow through the device when it is powered

down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power

down, which prevents driver conflict. The BIAS VCC circuitry precharges and preconditions the B-port input/output

connections, preventing disturbance of active data on the backplane during card insertion or removal, and

permits true live-insertion capability.

This GTLP device features TI-OPC circuitry, which actively limits overshoot caused by improperly terminated

backplanes, unevenly distributed cards, or empty slots during low-to-high signal transitions. This improves signal

integrity, which allows adequate noise margin to be maintained at higher frequencies.

Active bus-hold circuitry holds unused or undriven LVTTL data inputs at a valid logic state. Use of pullup or

pulldown resistors with the bus-hold circuitry is not recommended.

When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down.

However, to ensure the high-impedance state above 1.5 V, the output-enable (OE) input should be tied to VCC

through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the

driver.