SN54SC8T164-SEP中文资料具有逻辑电平移位器的抗辐射 8 位移位寄存器数据手册TI规格书

描述 Description

The SN54SC8T164-SEP device contains an 8-bit shift register with AND-gated serial inputs and an asynchronous clear (CLR) input. The gated serial (A and B) inputs permit complete control over incoming data; a low at either input inhibits entry of the new data and resets the first flip-flop to the low level at the next clock (CLK) pulse. A high-level input enables the other input, which then determines the state of the first flip-flop. Data at the serial inputs can be changed while CLK is high or low, provided the minimum set-up time requirements are met. Clocking occurs on the low-to-high-level transition of CLK.

The input is designed with a reduced threshold circuit to support up translation when the supply voltage is larger than the input voltage. Additionally, the 5V tolerant input pins enable down translation when the input voltage is larger than the supply voltage. The output level is always referenced to the supply voltage (VCC) and supports 1.8V, 2.5V, 3.3V, and 5V CMOS levels.

特性 Features

Vendor item drawing available, VID V62/25620-01XE

Radiation - Total Ionizing Dose (TID):

TID characterized up to 50krad(Si)

TID performance assurance up to 30krad(Si)

Radiation Lot Acceptance Testing (RLAT) for every wafer lot up to 30krad(Si)



Radiation - Single-Event Effects (SEE):

Single Event Latch-Up (SEL) immune up to 50MeV-cm2/mg at 125°C

Single Event Transient (SET) characterized up to LET = 50MeV-cm2/mg



Wide operating range of 1.2V to 5.5V

Single-supply voltage translator:

Up translation:

1.2V to 1.8V

1.5V to 2.5V

1.8V to 3.3V

3.3V to 5.0V



Down translation:

5.0V, 3.3V, 2.5V to 1.8V

5.0V, 3.3V to 2.5V

5.0V to 3.3V





5.5V tolerant input pins

Supports standard pinouts

Up to 150Mbps with 5V or 3.3V VCC

Latch-up performance exceeds 250mA per JESD 17

Space enhanced plastic:

Supports defense and aerospace applications

Controlled baseline

Au bondwire and NiPdAu lead finish

Meets NASA ASTM E595 outgassing specification

One fabrication, assembly, and test site

Extended product life cycle

Product traceability