SKY19237-001数据手册Skyworks中文资料规格书

描述 Description

The SKY19237-001 is a wafer level chip scale package (WLCSP)triple-shunt, single-pole, single-throw (3xSPST) switch withintegrated logic and bias block. The three paths are connected onone side to a single RF ground bump.

The part is designed to sustain a peak voltage of 83 V typicalwithout going to breakdown.

The switching is controlled by an integrated Mobile IndustryProcessor Interface (MIPI) decoder.

The SKY19237-001 is provided in a compact 11-bump,1.66 × 1.75 × 0.5 mm (typical) WLCSP that meets requirementsfor board-level assembly. Bump diameters are 262 m, with aminimum bump pitch of 400 m.

特性 Features

• Broadband frequency range: 0.7 to 2.7 GHz
• Vpeak: 83 V
• RON: 2.1 Ω
• COFF: 190 fF
• Three USIDs with single pin
• Supply voltage: 2.5 to 4.8 V
• Control logic: MIPI
• Ultra-small WLCSP (11-bump, 1.685 × 1.775 × 0.547 mm [maximum], 262 µm diameter, 400 µm pitch) package (MSL1, 260 °C per JEDEC J-STD-020)

应用 Application

• Smartphones
• Mobile Antenna Management
• 4G LTE