SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER

SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER VOLTAGE 20-60 Volts CURRENT 2 Amperes FEATURES • Plastic package has Underwriters Laboratory Flammability Classification 94V-O • For surface mounted applications • Low profile package • Built-in strain relief • Metal to silicon rectifier. majority ca

文件：186.45 Kbytes 页数：4 Pages

PANJIT

強茂

SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER

FEATURES ◆ The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 ◆ For surface mounted applications ◆ Metal silicon junction,majority carrier conduction ◆ Low power loss,high efficiency ◆ Built-in strain relief,ideal for automated placement ◆ High forward surg

文件：627.68 Kbytes 页数：2 Pages

CHENDA

辰达半导体

IGBT Module

Features • Compact design • One screw mounting • Heat transfer and isolation through direct copper bonding aluminium oxide ceramic (DBC) • N-channel homegeneous silicon structure (NPT-Non punch-through IGBT) • High short circuit capability • Low tail current with low temperature dependence

文件：424.76 Kbytes 页数：4 Pages

SEMIKRON

赛米控丹佛斯

IGBT Module

Features • Compact design • One screw mounting • Heat transfer and isolation through direct copper bonding aluminium oxide ceramic (DBC) • N-channel homegeneous silicon structure (NPT-Non punch-through IGBT) • High short circuit capability • Low tail current with low temperature dependence

文件：419.47 Kbytes 页数：4 Pages

SEMIKRON

赛米控丹佛斯

IGBT Module

Features • Compact design • One screw mounting • Heat transfer and isolation through direct copper bonding aluminium oxide ceramic (DBC) • N-channel homegeneous silicon structure (NPT-Non punch-through IGBT) • High short circuit capability • Low tail current with low temperature dependence

文件：424.76 Kbytes 页数：4 Pages

SEMIKRON

赛米控丹佛斯

IGBT Module

Features • Compact design • One screw mounting • Heat transfer and isolation through direct copper bonding aluminium oxide ceramic (DBC) • N-channel homegeneous silicon structure (NPT-Non punch-through IGBT) • High short circuit capability • Low tail current with low temperature dependence

文件：419.47 Kbytes 页数：4 Pages

SEMIKRON

赛米控丹佛斯

IGBT Module

Features • Compact design • One screw mounting • Heat transfer and isolation through direct copper bonding aluminium oxide ceramic (DBC) • N-channel homegeneous silicon structure (NPT-Non punch-through IGBT) • High short circuit capability • Low tail current with low temperature dependence

文件：419.47 Kbytes 页数：4 Pages

SEMIKRON

赛米控丹佛斯

IGBT Module

SEMITOP® 1 IGBT Module

文件：428.91 Kbytes 页数：4 Pages

SEMIKRON

赛米控丹佛斯

IGBT Module

Features • One screw mounting module • Trench4 IGBT technology • CAL4 technology FWD

文件：766.6 Kbytes 页数：5 Pages

SEMIKRON

赛米控丹佛斯

3-phase bridge inverter

Features • Compact design • One Screw mounting • Heat transfer and isolation through direct copper bonded aluminium oxide ceramic (DCB) • Ultrafast NPT technology IGBT • CAL technology FWD • Integrated NTC temperature sensor Typical Applications • Inverter

文件：713.69 Kbytes 页数：4 Pages

SEMIKRON

赛米控丹佛斯