3-phase bridge inverter

Features • Compact design • One screw mounting • Heat transfer and isolation through direct copper bonded aluminium oxide ceramic (DCB) • Ultrafast NPT technology IGBT • CAL technology FWD • Integrated NTC temperature sensor Typical Applications • Inverter

文件：723.13 Kbytes 页数：4 Pages

SEMIKRON

赛米控丹佛斯

Sixpack Open Emitter

Features* • One screw mounting module • Solder free mounting with Press-Fit terminals • Fully compatible with other SEMITOP® Press-Fit types • Trench4 IGBT technology • CAL4F technology FWD • Integrated NTC temperature sensor • UL recognized, file no. E 63 532 Typical Applications • M

文件：618.92 Kbytes 页数：6 Pages

SEMIKRON

赛米控丹佛斯

IGBT module

Features* • Low inductive design • Press-Fit contact technology • Rugged mounting due to integrated mounting clamps • Heat transfer and insulation through direct copper bonded aluminium oxide ceramic (DBC) • Trench4 IGBT technology • Robust and soft switching CAL4F diode technology • In

文件：806.93 Kbytes 页数：8 Pages

SEMIKRON

赛米控丹佛斯

Sixpack Open Emitter

Features* • Optimized design for superior thermal performance • Low inductive design • Press-Fit contact technology • 1200V Generation 7 IGBT (T7) • Robust and soft switching CAL4F diode technology • Integrated NTC temperature sensor • UL recognized file no. E 63 532 Typical Applicatio

文件：821.97 Kbytes 页数：8 Pages

SEMIKRON

赛米控丹佛斯

IGBT Module

Typical Applications • Switching (not for linear use) • Inverter • Switching mode power supplies • UPS

文件：472.51 Kbytes 页数：4 Pages

SEMIKRON

赛米控丹佛斯

Antiparallel Thyristor Module

Features • Compact Design • One screw mounting • Heat transfer and isolation through direct copper bonded aluminium oxide ceramic (DBC) • Glass passived thyristor chips • Up to 1600V reverse voltage • UL recognized, file no. E63 532 Typical Applications • Soft starters

文件：367.34 Kbytes 页数：3 Pages

SEMIKRON

赛米控丹佛斯

Antiparallel Thyristor Module

Features • Compact Design • One screw mounting • Heat transfer and isolation through direct copper bonded aluminium oxide ceramic (DBC) • Glass passived thyristor chips • Up to 1600V reverse voltage • UL recognized, file no. E63 532 Typical Applications • Soft starters

文件：367.34 Kbytes 页数：3 Pages

SEMIKRON

赛米控丹佛斯

Antiparallel Thyristor Module

Features • Compact Design • One screw mounting • Heat transfer and isolation through direct copper bonded aluminium oxide ceramic (DBC) • Glass passived thyristor chips • Up to 1600V reverse voltage • UL recognized, file no. E63 532 Typical Applications • Soft starters

文件：367.34 Kbytes 页数：3 Pages

SEMIKRON

赛米控丹佛斯

Antiparallel Thyristor Module

Features • Compact Design • One screw mounting • Heat transfer and isolation through direct copper bonded aluminium oxide ceramic (DBC) • Glass passived thyristor chips • Up to 1600V reverse voltage • UL recognized, file no. E63 532 Typical Applications • Soft starters

文件：367.34 Kbytes 页数：3 Pages

SEMIKRON

赛米控丹佛斯

2 Amp Schottky Rectifier 20 to 200 Volts

Features • Lead Free Finish/Rohs Compliant (Note1) (PSuffix designates Compliant. See ordering information) • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Low Forward Voltage • Halogen free available upon request by adding suffix -HF • High Current Capability •

文件：358.96 Kbytes 页数：4 Pages

MCC