IGBT模块

·One screw mounting module\n·Solder free mounting with Press-Fit terminals\n·Fully compatible with SEMITOP® 2 and 3 Press-Fit\n·Improved thermal performances by aluminum oxide substrate\n·Trench4 IGBT technology\n·CAL4F diode technology\n·Integrated PTC temperature sensor\n·UL recognized, file no. E;

Semikron-DANFOSS

赛米控丹佛斯

IGBT模块

·One screw mounting module \n·Fully compatible with SEMITOP®1,2,3 \n·Improved thermal performances by aluminium oxide substrate \n·Trench IGBT technology \n·CAL technology FWD \n·Integrated NTC temperature sensor;

Semikron-DANFOSS

赛米控丹佛斯

Electrolytic Capacitors

YAGEO

国巨

包装：散装 类别：盒子，外壳，机架 箱 描述：SMT COMPONENT ENCLOSURE WITH 200

ANALOGTECHNOLOGIES

包装：盒 类别：套件 EMI，滤波器套件 描述：CERAMIC FEED-THRU CAP SAMPLE KIT

Tusonix a Subsidiary of CTS Electronic Components

Package：R-6，轴向；包装：管件 类别：分立半导体产品 二极管 - 整流器 - 单 描述：DIODE SCHOTTKY 45V 20A R-6

TSC

台湾半导体