3-Level TNPC Inverter

Features • One screw mounting module • Solder free mounting with Press-Fit terminals • Fully compatible with other SEMITOP® Press-Fit types • Improved thermal performances by aluminium oxide substrate • 1200V Fast Trench4 IGBT and 650V Trench3 IGBT technology • CAL4F technology FWD • In

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Semikron

赛米控丹佛斯

IGBT模块

·One screw mounting module\n·Solder free mounting with Press-Fit terminals\n·Fully compatible with other SEMITOP® Press-Fit types\n·Improved thermal performances by aluminium oxide substrate\n·1200V Fast Trench4 IGBT and 650V Trench3 IGBT technology\n·CAL4F technology FWD \n·Integrated NTC temperatu;

Semikron-DANFOSS

赛米控丹佛斯

UTC
SOT23 T/R

UTC

友顺

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UTC(友顺)
SOT23

UTC(友顺)

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MCC
SMA(DO-214AC)

MCC

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