H-Bridge Open Source (Full SiC)

Features* • Optimized design for superior thermal performance • Low inductance design • Press-Fit contact technology • 1200V Trench Gen4 SiC MOSFET • Unipolar gate control • Optimized switching stability thanks to module integrated gate resistors • Integrated NTC temperature sensor • UL

文件：215.82 Kbytes 页数：6 Pages

SEMIKRON

赛米控丹佛斯

H-Bridge Open Source (Full SiC)

Features* • Optimized design for superior thermal performance • Low inductance design • Press-Fit contact technology • 1200V Trench Gen4 SiC MOSFET • Unipolar gate control • Optimized switching stability thanks to module integrated gate resistors • Integrated NTC temperature sensor • UL

文件：279.37 Kbytes 页数：6 Pages

SEMIKRON

赛米控丹佛斯

3-Level NPC Inverter

Features • One screw mounting module • Solder free mounting with Press-Fit terminals • Fully compatible with other SEMITOP® Press-Fit types • Improved thermal performances by aluminum oxide substrate • 650V Trench IGBT technology • CAL4F technology FWD • Rapid switching clamping diode t

文件：1.06656 Mbytes 页数：10 Pages

SEMIKRON

赛米控丹佛斯

3-Level NPC

Features* • Optimized design for superior thermal performance • Low inductive design • Press-Fit contact technology • Split IGBT gates for optimized driving • 650V Trench5 IGBT (S5) • Rapid switching diode technology • Integrated NTC temperature sensor • UL recognized file no. E 63 532

文件：1.46371 Mbytes 页数：11 Pages

SEMIKRON

赛米控丹佛斯

Two separated thyristors

Features* • Compact design • One screw mounting • Solder free mounting with Press-Fit terminals • High current density due to double mesa technology • Heat transfer and insulation through direct copper bonded aluminum oxide ceramic (DBC) • Glass passivated thyristor chips • Up to 1600V

文件：420.35 Kbytes 页数：4 Pages

SEMIKRON

赛米控丹佛斯

Thyristor and Diode separated in the same housing

Features* • Compact design • One screw mounting • High current density due to double mesa technology • Heat transfer and insulation through direct copper bonded aluminum oxide ceramic (DBC) • Glass passivated thyristor chips • High surge currents • UL recognized, file no. E 63 532 Typ

文件：486.86 Kbytes 页数：5 Pages

SEMIKRON

赛米控丹佛斯

Thyristor

Features • Compact design • One Screw mounting • Heat transfer and isolation through direct copper bonded aluminium oxide ceramic (DCB) • Glass passivated thyristor chips • Up to 1600V reverse voltage • UL recognized, file no. E 63 532 Typical Applications • Soft starters • Light control

文件：291.79 Kbytes 页数：2 Pages

SEMIKRON

赛米控丹佛斯

Thyristor

Features • Compact design • One Screw mounting • Heat transfer and isolation through direct copper bonded aluminium oxide ceramic (DCB) • Glass passivated thyristor chips • Up to 1600V reverse voltage • UL recognized, file no. E 63 532 Typical Applications • Soft starters • Light control

文件：291.79 Kbytes 页数：2 Pages

SEMIKRON

赛米控丹佛斯

Thyristor

Features • Compact design • One Screw mounting • Heat transfer and isolation through direct copper bonded aluminium oxide ceramic (DCB) • Glass passivated thyristor chips • Up to 1600V reverse voltage • UL recognized, file no. E 63 532 Typical Applications • Soft starters • Light control

文件：291.79 Kbytes 页数：2 Pages

SEMIKRON

赛米控丹佛斯

Thyristor

Features • Compact design • One Screw mounting • Heat transfer and isolation through direct copper bonded aluminium oxide ceramic (DCB) • Glass passivated thyristor chips • Up to 1600V reverse voltage • UL recognized, file no. E 63 532 Typical Applications • Soft starters • Light control

文件：291.79 Kbytes 页数：2 Pages

SEMIKRON

赛米控丹佛斯