IGBT模块

• Solderless assembling solution with PressFIT signal pins and screw power terminals\n• IGBT 4 Trench Gate Technology\n• VCE(sat) with positive temperature coefficient\n• Low inductance case\n• Reliable mechanical design with injection moulded terminals and reliable internal connections\n• UL recogn;

Semikron-DANFOSS

赛米控丹佛斯

IGBT模块

• Solderless assembling solution with PressFIT signal pins and screw power terminals\n• IGBT 4 Trench Gate Technology\n• VCE(sat) with positive temperature coefficient\n• Low inductance case\n• Reliable mechanical design with injection moulded terminals and reliable internal connections\n• UL recogn;

Semikron-DANFOSS

赛米控丹佛斯

3-Level NPC IGBT-Module

Features* • Solderless assembling solution with PressFIT signal pins and screw power terminals • IGBT 4 Trench Gate Technology • VCE(sat) with positive temperature coefficient • Low inductance case • Reliable mechanical design with injection moulded terminals and reliable internal connec

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Semikron

赛米控丹佛斯

IGBT

SEMIKRON/赛米控

上传：深圳市鑫炜纳电子有限公司

COILCRAFT

上传：深圳市三芯电子有限公司