SC18IS602BIPW/S8集成电路（IC）的控制器规格书PDF中文资料

厂商型号	SC18IS602BIPW/S8
参数属性	SC18IS602BIPW/S8 封装/外壳为16-TSSOP（0.173"，4.40mm 宽）；包装为卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带；类别为集成电路（IC）的控制器；产品描述：IC BRIDGE SPI/I2C 16TSSOP
功能描述	I2C-bus to SPI bridge
丝印标识	IS602B
封装外壳	TSSOP16 / 16-TSSOP（0.173"，4.40mm 宽）
文件大小	250.15 Kbytes
页面数量	25 页
生产厂商	NXP Semiconductors
企业简称	nxp【恩智浦】
中文名称	恩智浦半导体公司官网
原厂标识
数据手册	下载地址一下载地址二到原厂下载
更新时间	2025-5-24 20:00:00
人工找货	SC18IS602BIPW/S8价格和库存，欢迎联系客服免费人工找货

General description

The SC18IS602B is designed to serve as an interface between a standard I2C-bus of a

microcontroller and an SPI bus. This allows the microcontroller to communicate directly

with SPI devices through its I2C-bus. The SC18IS602B operates as an I2C-bus

slave-transmitter or slave-receiver and an SPI master. The SC18IS602B controls all the

SPI bus-specific sequences, protocol, and timing. The SC18IS602B has its own internal

oscillator, and it supports four SPI chip select outputs that may be configured as GPIO

when not used.

Features and benefits

 I2C-bus slave interface operating up to 400 kHz

 SPI master operating up to 1.8 Mbit/s

 200-byte data buffer

 Up to four slave select outputs

 Up to four programmable I/O pins

 Operating supply voltage: 2.4 V to 3.6 V

 Low power mode

 Internal oscillator option

 Active LOW interrupt output

 ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per

JESD22-A115, and 1000 V CDM per JESD22-C101

 Latch-up testing is done to JEDEC Standard JESD78 that exceeds 100 mA

 Very small 16-pin TSSOP