首页>S70WS512N00BFWAB3>规格书详情
S70WS512N00BFWAB3中文资料飞索数据手册PDF规格书
| 厂商型号 |
S70WS512N00BFWAB3 |
| 功能描述 | Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory |
| 文件大小 |
1.04414 Mbytes |
| 页面数量 |
93 页 |
| 生产厂商 | SPANSION |
| 企业简称 |
SPANSION【飞索】 |
| 中文名称 | 飞索半导体官网 |
| 原厂标识 |  |
| 数据手册 | |
| 更新时间 | 2025-7-4 23:00:00 |
| 人工找货 | S70WS512N00BFWAB3价格和库存，欢迎联系客服免费人工找货 |
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S70WS512N00BFWAB3规格书详情
General Description
The S70WS512N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists of two S29WS-N flash memory die.
Distinctive Characteristics
MCP Features
■ Power supply voltage of 1.7 V to 1.95 V
■ Burst Speed: 54 MHz, 66 MHz
■ Package
— 8 x 11.6 mm
■ Operating Temperature
— Wireless, –25°C to +85°C
产品属性
- 型号：
S70WS512N00BFWAB3
- 制造商：
SPANSION
- 制造商全称：
SPANSION
- 功能描述：
Same-Die Stacked Multi-Chip Product(MCP) 512 Megabit(32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
PERIPHERAL |
24+ |
NA/ |
3265 |
原厂直销,现货供应,账期支持! |
询价 | ||
TDK |
23+ |
QFP64 |
20000 |
全新原装假一赔十 |
询价 | ||
SAMSUNG |
17+ |
CSP30 |
1000 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
询价 | ||
MaxLinear |
20+ |
原装 |
9850 |
处理器专门应用-可开原型号增税票 |
询价 | ||
TDK |
98+ |
QFP64 |
1335 |
全新原装进口自己库存优势 |
询价 | ||
EXAR |
FCBGA |
18 |
10000 |
原装正品 |
询价 | ||
STRETCH |
25+23+ |
BGA84 |
35768 |
绝对原装正品全新进口深圳现货 |
询价 | ||
IPAIRGAIN |
24+ |
BGA |
35200 |
一级代理/放心采购 |
询价 | ||
STRETCH |
1948+ |
BGA |
6852 |
只做原装正品现货!或订货假一赔十! |
询价 | ||
ST |
23+ |
BGA |
16900 |
正规渠道,只有原装! |
询价 |
