丝印：S2KB；Package：SMBF；Surface Mount General Purpose Silicon Rectifiers

Features For surface mounted applications Low profile package Glass passivated chip junction Easy to pick and place Lead free in comply with EU RoHS 2011/65/EU directives

文件：2.33683 Mbytes 页数：4 Pages

UNSEMI

优恩半导体

丝印：S2KB；Package：SMBF；Surface Mount General Purpose Silicon Rectifiers

文件：439.61 Kbytes 页数：3 Pages

SKTECHNOLGYSHIKE Electronics

时科广东时科微实业有限公司

丝印：S2KB；Package：SMBF；Surface Mount General Purpose Silicon Rectifiers

文件：406.92 Kbytes 页数：3 Pages

YFWDIODE

佑风微

丝印：S2KB；Package：SMBF；SURFACE MOUNT GENERAL PURPOSE SILICON RECTIFIERS

文件：753.75 Kbytes 页数：3 Pages

PJSEMI

平晶半导体

SURFACE MOUNT GENERAL PURPOSE SILICON RECTIFIER

FEATURES ♦ For surface mounted applications ♦ Low profile package ♦ Glass Passivated Chip Junction ♦ Lead free in comply with EU RoHS 2011/65/EU diretives ♦ Easy to pick and place

文件：615.84 Kbytes 页数：2 Pages

CHENDA

辰达半导体

SURFACE MOUNT STANDARD RECOVERY RECTIFIER

FEATURES • For surface mount applications • Glass passivated junction • Low profile package • Built-in strain relief • Easy pick and place • Low forward voltage drop • Plastic package has Underwriters Laboratory Flammability Classification 94V-0 • High temperature soldering 250°C/10 second

文件：129.86 Kbytes 页数：2 Pages

PACELEADER

霈峰

Surface Mount General Purpose Silicon Rectifiers

文件：488.51 Kbytes 页数：3 Pages

YINT

音特电子

Surface MountGeneral Purpose Silicon Rectifiers

FEATURES • For surface mounted applications • Low profile package • Glass Passivated Chip Junction • Easy to pick and place • Lead free in comply with EU RoHS 2011/65/EU directives

文件：86.16 Kbytes 页数：3 Pages

YFWDIODE

佑风微

2.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER

Features ● Ideally Suited for Automatic Assembly ● Low Forward Voltage Drop ● Surge Overload Rating to 35 A Peak ● Low Power Loss ● Built-in Strain Relief ● Plastic Case Material has UL Flammability Classification Rating 94V-O

文件：167.05 Kbytes 页数：2 Pages

ZSELEC

淄博圣诺

SURFACE MOUNT GENERAL PURPOSE SILICON RECTIFIER

FEATURES ♦ For surface mounted applications ♦ Low profile package ♦ Glass Passivated Chip Junction ♦ Lead free in comply with EU RoHS 2011/65/EU diretives ♦ Easy to pick and place

文件：617.19 Kbytes 页数：2 Pages

CHENDA

辰达半导体