双接口智能卡模块

Dual interface module with inductive coupling and 6 CB contacts The innovative ’Coil on Module’ package technology from Infineon uses a radiofrequency link rather than the common mechanical-electrical connection between the card antenna and the module, it employs two antennas, one on the modul • Pitch: 14.25mm\n• Dimensions: 13 x 11.8mm\n• Thickness: max. 470µm\n• Contact surface: NiAu\n• ISO 7816-1, ISO 7810, ISO 10373-1/-3\n• Derivates: Au surface, Pd surface\n• Tape on Reel\n\n优势:;

Infineon

英飞凌

UF cores and UI cores

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YUXIANG

SOT23-5

SII

精工爱普生

上传：深圳市金瑞宝科技有限公司

LRC乐山无线电

上传：深圳市三芯电子有限公司