RX130_V01中文资料瑞萨数据手册PDF规格书
厂商型号 |
RX130_V01 |
功能描述 | 32-MHz, 32-bit RX MCUs, 50 DMIPS, up to 512-KB flash memory, up to 36 pins capacitive touch sensing unit, up to 6 comms channels, 12-bit A/D, D/A, RTC, IEC60730 compliance, 1.8-V to 5.5-V single supply |
文件大小 |
2.48612 Mbytes |
页面数量 |
134 页 |
生产厂商 | Renesas Technology Corp |
企业简称 |
RENESAS【瑞萨】 |
中文名称 | 瑞萨科技有限公司官网 |
原厂标识 | |
数据手册 | |
更新时间 | 2024-9-25 18:36:00 |
RX130_V01规格书详情
Features
■ 32-bit RX CPU core
• Max. operating frequency: 32 MHz
Capable of 50 DMIPS in operation at 32 MHz
• Accumulator handles 64-bit results (for a single instruction) from
32-bit × 32-bit operations
• Multiplication and division unit handles 32-bit × 32-bit operations
(multiplication instructions take one CPU clock cycle)
• Fast interrupt
• CISC Harvard architecture with 5-stage pipeline
• Variable-length instructions, ultra-compact code
• On-chip debugging circuit
■ Low power design and architecture
• Operation from a single 1.8-V to 5.5-V supply
• Three low power consumption modes
• Low power timer (LPT) that operates during the software standby state
• Supply current
High-speed operating mode: 96 μA/MHz
Supply current in software standby mode: 0.37 μA
• Recovery time from software standby mode: 4.8 μs
■ On-chip flash memory for code, no wait states
• 64 K/128 K/256 K/383 K/512 Kbytes
• Operation at 32 MHz, read cycle of 31.25 ns
• No wait states for reading at full CPU speed
• Programmable at 1.8 V
• For instructions and operands
■ On-chip data flash memory
• 8 Kbytes (1,000,000 program/erase cycles (typ.))
• BGO (Background Operation)
■ On-chip SRAM, no wait states
• 10 K/16 K/32 K/48 Kbytes size capacities
■ DTC
• Four transfer modes
• Transfer can be set for each interrupt source.
■ ELC
• Module operation can be initiated by event signals without using
interrupts.
• Linked operation between modules is possible while the CPU is sleeping.
■ Reset and supply management
• Eight types of reset, including the power-on reset (POR)
• Low voltage detection (LVD) with voltage settings
■ Clock functions
• External clock input frequency: Up to 20 MHz
• Main clock oscillator frequency: 1 to 20 MHz
• Sub clock oscillator frequency: 32.768 kHz
• PLL circuit input: 4 MHz to 8 MHz
• Low-speed on-chip oscillator: 4 MHz
• High-speed on-chip oscillator: 32 MHz ± 1
• IWDT-dedicated on-chip oscillator: 15 kHz
• Generate a 32.768 kHz clock for the real-time clock
• On-chip clock frequency accuracy measurement circuit (CAC)
■ Realtime clock
• Adjustment functions (30 seconds, leap year, and error)
• Calendar count mode or binary count mode selectable
■ Independent watchdog timer
• 15-kHz on-chip oscillator produces a dedicated clock signal to drive
IWDT operation.
■ Useful functions for IEC60730 compliance
• Self-diagnostic and disconnection-detection assistance functions for
the A/D converter, clock frequency accuracy measurement circuit,
independent watchdog timer, RAM test assistance functions using the
DOC, etc.
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询价 |