RS07B-M_V01中文资料威世科技数据手册PDF规格书

FEATURES

• For surface mounted applications

• Low profile package

• Ideal for automated placement

• Glass passivated

• Meets MSL level 1, per J-STD-020,

LF maximum peak of 260 °C

• Meets JESD 201 class 2 whisker test

• Wave and reflow solderable

• Base P/N-M - halogen-free, RoHS-compliant

• Base P/N-HM3 - halogen-free, RoHS-compliant, and

AEC-Q101 qualified

• Compatible to SOD-123W package case outline or

SOD-123F and SOD-123FL

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912