RPC56AP60L3数据手册ST中文资料规格书

描述 Description

This 32-bit system-on-chip (SoC) microcontroller family is the latest achievement in integrated application controllers.
This family is one of a series of next-generation integrated microcontrollers based on the Power Architecture technology.
The advanced and cost-efficient host processor core of this controller family complies with the Power Architecture embedded category. It operates up to 64 MHz and offers high performance processing optimized for low power consumption. It capitalizes on the available development infrastructure of current Power Architecture devices and is supported with software drivers, operating systems and configuration code to assist with users implementations.

特性 Features

64 MHz, single issue, 32-bit CPU core complex (e200z0h)Compliant with Power Architecture®embedded category
Variable Length Encoding (VLE)

Memory organizazionUp to 1024 KB on-chip code Flash memory with additional 64 KB for EEPROM emulation (data flash), with ECC, with erase/program controller
Up to 80 KB on-chip SRAM with ECC

Fail safe protectionECC protection on system SRAM and Flash
Safety port
SWT with servicing sequence pseudo-random generator
Power management
Non-maskable interrupt for both cores
Fault collection and control unit (FCCU)
Safe mode of system-on-chip (SoC)
Register protection scheme

Nexus®L2+ interface
Single 3.3 V or 5 V supply for I/Os and ADC
2 on-platform peripherals set with 2 INTC
16-channel eDMA controller with multiple transfer request sources
General purpose I/Os
2 general purpose eTimer units6 timers, each with up/down count capabilities
16-bit resolution, cascadable counters
Quadrature decode with rotation direction flag
Double buffer input capture and output compare

Communications interfaces2 LINFlex modules (LIN 2.1, 1 × Master/Slave, 1 × Master Only)
5 DSPI modules with automatic chip select generation
2 FlexCAN interfaces (2.0B Active) with 32 message buffers
1 Safety port based on FlexCAN; usable as third CAN when not used as safety port
1 FlexRay™ module (V2.1) with dual or single channel, 64 message buffers and up to 10 Mbit/s

2 CRC units with three contexts and 3 hardwired polynomials
10-bit A/D converter27 input channels and pre-sampling feature
Conversion time < 1 μs including sampling time at full precision
Programmable cross triggering unit (CTU)
4 analog watchdog with interrupt capability

On-chip CAN/UART Bootstrap loader with boot assist module (BAM)
Ambient temperature ranges: –40 to 125 °C
Aerospace and Defense featuresDedicated traceability and part marking
Production parts approval documents available
Adapted Extended life time and obsolescence management
Extended Product Change Notification process
Designed and manufactured to meet sub ppm quality goals
Advanced mold and frame designs for Superior resilience to harsh environment (acceleration, EMI, thermal, humidity)
Single Fabrication, Assembly and Test site
Dual internal production source capability