丝印：R8C；Package：SOT-23(DBZ)；LM4040-N/-Q1 Precision Micropower Shunt Voltage Reference

1 Features • LM4040-N-Q1 AEC Q-100 qualified for automotive applications – Extended Grade 1: −40°C to +125°C, TA – Industrial Grade 3: −40°C to +85°C, TA • Small packages: SOT-23, TO-92, and SC70 • No output capacitor required • Tolerates capacitive loads • Fixed reverse breakdown voltages

文件：1.8873 Mbytes 页数：84 Pages

TI

德州仪器

丝印：R8C；Package：SOT-23(DBZ)；LM4040-N/-Q1 Precision Micropower Shunt Voltage Reference

1 Features • LM4040-N-Q1 AEC Q-100 qualified for automotive applications – Extended Grade 1: −40°C to +125°C, TA – Industrial Grade 3: −40°C to +85°C, TA • Small packages: SOT-23, TO-92, and SC70 • No output capacitor required • Tolerates capacitive loads • Fixed reverse breakdown voltages

文件：1.8873 Mbytes 页数：84 Pages

TI

德州仪器

16-BIT SINGLE-CHIP MICROCOMPUTER M16C FAMILY / R8C /Tiny SERIES

Overview This MCU is built using the high-performance silicon gate CMOS process using a R8C Tiny Series CPU core and is packaged in a 32-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1M bytes of address space, it

文件：1.79142 Mbytes 页数：198 Pages

RENESAS

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RENESAS MCU R8C FAMILY / R8C/2x SERIES

Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. ThisMCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1 Mbyte of address space, it is capabl

文件：5.36222 Mbytes 页数：549 Pages

RENESAS

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RENESAS MCU R8C FAMILY / R8C/2x SERIES

Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. ThisMCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1 Mbyte of address space, it is capabl

文件：5.36222 Mbytes 页数：549 Pages

RENESAS

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RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES

Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. Wit

文件：5.28734 Mbytes 页数：525 Pages

RENESAS

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RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES

Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. Wit

文件：5.28734 Mbytes 页数：525 Pages

RENESAS

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RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES

Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab

文件：4.66437 Mbytes 页数：485 Pages

RENESAS

瑞萨

RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES

Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab

文件：4.66437 Mbytes 页数：485 Pages

RENESAS

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RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES

Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capa

文件：4.52117 Mbytes 页数：471 Pages

RENESAS

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