SINGLE-CHIP 16-BIT CMOS MCU

Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab

文件：597.24 Kbytes 页数：73 Pages

RENESAS

瑞萨

RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES

Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab

文件：4.66437 Mbytes 页数：485 Pages

RENESAS

瑞萨

SINGLE-CHIP 16-BIT CMOS MCU

Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab

文件：597.24 Kbytes 页数：73 Pages

RENESAS

瑞萨

RENESAS 16-BIT SINGLE-CHIP MCU R8C FAMILY / R8C/2x SERIES

Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab

文件：4.66437 Mbytes 页数：485 Pages

RENESAS

瑞萨

SINGLE-CHIP 16-BIT CMOS MCU

Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capab

文件：597.24 Kbytes 页数：73 Pages

RENESAS

瑞萨