RENESAS MCU R8C FAMILY / R8C/2x SERIES

Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. ThisMCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1 Mbyte ofaddress space, it is c

文件：4.8906 Mbytes 页数：501 Pages

RENESAS

瑞萨

RENESAS MCU R8C FAMILY / R8C/2x SERIES

Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. ThisMCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1 Mbyte ofaddress space, it is c

文件：4.8906 Mbytes 页数：501 Pages

RENESAS

瑞萨

R8C/20 Group, R8C/21 Group RENESAS MCU

文件：432.29 Kbytes 页数：47 Pages

RENESAS

瑞萨

R8C/20 Group, R8C/21 Group RENESAS MCU

文件：432.29 Kbytes 页数：47 Pages

RENESAS

瑞萨

16-bit Microcontrollers with R8C CPU Core (Non Promotion)

The R8C/20 Group is supported only for customers who have already adopted these products.\n\nThese MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic moldedHWQFN

Renesas

瑞萨

16-bit Microcontrollers with R8C CPU Core (Non Promotion)

The R8C/20 Group is supported only for customers who have already adopted these products.\n\nThese MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic moldedHWQFN

Renesas

瑞萨