首页 >QPA2263ASR>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
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WCDMAPowerAmplifierModule1920-1980MHz GeneralDescription TheRMPA2263PowerAmplifierModule(PAM)isFairchild’slatestinnovationin50Ohmmatched,surfacemountmodulestargetingUMTS/WCDMA/HSDPAapplications.Answeringthecallforultra-lowDCpowerconsumptionandextendedbatterylifeinportableelectronics,theRMPA2263us | FairchildFairchild Semiconductor 仙童半导体飞兆/仙童半导体公司 | Fairchild | ||
DC-5000MHz,CascadableSiGeHBTMMICAmplifier ProductDescription TheSGA-2263isahighperformanceSiGeHBTMMICAmplifier.ADarlingtonconfigurationfeaturing1micronemittersprovideshighFTandexcellentthermalperfomance.Theheterojunctionincreasesbreakdownvoltageandminimizesleakagecurrentbetweenjunctions.Cancellationof | SIRENZA SIRENZA MICRODEVICES | SIRENZA | ||
DC-5000MHZCASCADABLESIGEHBTMMICAMPLIFIER ProductDescription StandfordMicrodevicesSGA-2263isahighperformanceSiGeHBTMMICAmplifier.ADarlingtonconfigurationfeaturing1micronemittersprovideshighFTandexcellentthermalperfomance.Theheterojunctionincreasesbreakdownvoltageandminimizesleakagecurrentbetweenjunctio | STANFORD Stanford Microdevices | STANFORD | ||
DCto5000MHz,CASCADABLESiGeHBTMMICAMPLIFIER | RFMDRF Micro Devices 威讯联合威讯联合半导体(德州)有限公司 | RFMD | ||
DC-5000MHz,CascadableSiGeHBTMMICAmplifier ProductDescription TheSGA-2263isahighperformanceSiGeHBTMMICAmplifier.ADarlingtonconfigurationfeaturing1micronemittersprovideshighFTandexcellentthermalperfomance.Theheterojunctionincreasesbreakdownvoltageandminimizesleakagecurrentbetweenjunctions.Cancellationof | SIRENZA SIRENZA MICRODEVICES | SIRENZA | ||
DCto5000MHz,CASCADABLESiGeHBTMMICAMPLIFIER | RFMDRF Micro Devices 威讯联合威讯联合半导体(德州)有限公司 | RFMD | ||
DCto5000MHz,CASCADABLESiGeHBTMMICAMPLIFIER | RFMDRF Micro Devices 威讯联合威讯联合半导体(德州)有限公司 | RFMD | ||
SURFACEMOUNTTANTALUMCHIPSHJ | DUBILIER dubilier | DUBILIER | ||
SURFACEMOUNTTANTALUMCHIPSHJ | DUBILIER dubilier | DUBILIER | ||
HighPerformancePCIeGen3x4NVMe1.3SSDControllers | SILICONMOTIONSilicon Motion Technology Corp. 慧荣科技慧荣科技股份有限公司 | SILICONMOTION |
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