首页 >QMK-703T>规格书列表
| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
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Intel®Pentium®/Celeron®ApolloLakeSoCprocessorQsevenModule Features •OnboardIntel®Pentium®/Celeron®SoCBGAprocessor•OnboardDDR3L1600/1333MHz4GB,upto8GB•2xSATAIII,6xUSB2.0,2xUSB3.0,3xPCIe2.0•DualChannel18/24-bitLVDS+HDMI•SupportseMMC5.0,SDcard(SDIO3.0)•QsevenFormFactorRev.2.1Compliant•StandardTemperat | BCM bcm advanced search | BCM | ||
HIGHREPEATABILITY,TO-5RELAYSDPDT DESCRIPTION TheultraminiatureRF700andRF703relaysare designedtoprovideimprovedRFsignalswitching repeatabilityoverthefrequencyrange.Theserelaysare engineeredforuseinRFattenuator,RFswitchmatrices, ATEandotherapplicationsthatrequiredependable highfrequencysigna | TELEDYNE Teledyne Technologies Incorporated | TELEDYNE | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features •LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). •Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. •UltrasmallFlatLeadPackage(UFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features •LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). •Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. •UltrasmallFlatLeadPackage(UFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features •LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). •Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. •UltrasmallFlatLeadPackage(UFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features •LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). •Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. •ExtremelysmallFlatLeadPackage(SFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features •LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). •Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. •ExtremelysmallFlatLeadPackage(SFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforhighSpeedSwitching Features •LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). •Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. •ExtremelysmallFlatLeadPackage(EFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforhighSpeedSwitching Features •LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). •Wecansupportthelineupofenvironmentalfriendlyhalogenfreetypeonyourdemand. •ExtremelysmallFlatLeadPackage(EFP)issuitableforcompactandhigh-densitysurfacemountdesign. | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS | ||
SiliconSchottkyBarrierDiodeforHighSpeedSwitching Features •LowPowerconsumption(Lowreverseleakcurrent)andhighspeed(Lowcapacitance). •Halogenfree,EnvironmentalfriendlyPackageincludeConformitytoRoHSDirective. •UltrasmallPackage(0.6mm×0.3mmSizeleadlesstype) | RENESASRenesas Technology Corp 瑞萨瑞萨科技有限公司 | RENESAS |
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