25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

文件：528.06 Kbytes 页数：17 Pages

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25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

文件：528.06 Kbytes 页数：17 Pages

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60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

文件：239.12 Kbytes 页数：14 Pages

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25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

文件：528.06 Kbytes 页数：17 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

文件：528.06 Kbytes 页数：17 Pages

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25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

文件：528.06 Kbytes 页数：17 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

文件：239.12 Kbytes 页数：14 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

文件：528.06 Kbytes 页数：17 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

文件：528.06 Kbytes 页数：17 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

25,000 Usable PLD Gate pASIC 3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

文件：528.06 Kbytes 页数：17 Pages

ETCList of Unclassifed Manufacturers

未分类制造商