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QCC3

QCC3 FLEXIBLE CAPPING STRIP

文件:87.53 Kbytes 页数:1 Pages

QPSL

QCC3030B

Coaxial Circulator

Features: * High Power * High Isolation * Low Insertion Loss * Low VSWR Applications: * Wireless * Radar * Laboratory Test

文件:160.14 Kbytes 页数:2 Pages

QUALWAVE

扩维微波

QCC3033X

Coaxial Circulators

Features: * High Power * High Isolation * Low Insertion Loss * Low VSWR Applications: * Wireless * Radar * Laboratory Test

文件:166.6 Kbytes 页数:2 Pages

QUALWAVE

扩维微波

QCC3232X

Coaxial Circulators

Features: * High Power * High Isolation * Low Insertion Loss * Low VSWR Applications: * Wireless * Radar * Laboratory Test

文件:163.86 Kbytes 页数:2 Pages

QUALWAVE

扩维微波

QCC3234A

Coaxial Circulators

Features: * High Power * High Isolation * Low Insertion Loss * Low VSWR Applications: * Wireless * Radar * Laboratory Test

文件:194.28 Kbytes 页数:1 Pages

QUALWAVE

扩维微波

QCC3434E

Coaxial Circulators

Features: * High Power * High Isolation * Low Insertion Loss * Low VSWR Applications: * Wireless * Radar * Laboratory Test

文件:163.45 Kbytes 页数:2 Pages

QUALWAVE

扩维微波

QCC3538X

Coaxial Circulators

Features: * High Power * High Isolation * Low Insertion Loss * Low VSWR Applications: * Wireless * Radar * Laboratory Test

文件:268.8 Kbytes 页数:2 Pages

QUALWAVE

扩维微波

QCC3002

Bluetooth Audio SoCs

The QCC3002 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with mid to low tier Bluetooth wireless audio devices.\n\nThe QCC3002 supports Bluetooth headset applications. Coupled with • Dual-mode Bluetooth 5 qualified radio\n• Variants designed to address both headsets/headphones and speaker applications\n• Low-power Qualcomm® Kalimba™ DSP with on-chip ROM and RAM, stereo codec, battery charger, switch mode and linear regulators and LED drivers in a singlechip solution\n• Customi;

Qualcomm

高通

QCC3003

Bluetooth Audio SoCs

The QCC3003 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with mid to low tier Bluetooth wireless audio devices.\n\nThe QCC3003 supports Bluetooth headset applications. Coupled with • Dual-mode Bluetooth 5 qualified radio\n• Variants designed to address both headsets/headphones and speaker applications\n• Low-power Qualcomm® Kalimba™ DSP with on-chip ROM and RAM, stereo codec, battery charger, switch mode and linear regulators and LED drivers in a singlechip solution\n• Customi;

Qualcomm

高通

QCC3004

Bluetooth Audio SoCs

The QCC3004 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with mid to low tier Bluetooth wireless audio devices.\n\nThe QCC3004 supports Bluetooth headset applications. Coupled with • Dual-mode Bluetooth 5 qualified radio\n• Variants designed to address both headsets/headphones and speaker applications\n• Low-power Qualcomm® Kalimba™ DSP with on-chip ROM and RAM, stereo codec, battery charger, switch mode and linear regulators and LED drivers in a singlechip solution\n• Customi;

Qualcomm

高通

技术参数

  • 带宽(MHz,最大值):

    600

  • 插损(dB,最大值):

    0.6

  • 隔离度(dB,最小值):

    15

  • 驻波(最大值):

    1.45

  • 平均功率(W,最大值):

    200

  • 连接器:

    SMA

  • 温度(℃):

    -30~+70

  • 尺寸(mm):

    32*32*15

  • 货期(周):

    2~4

供应商型号品牌批号封装库存备注价格
原厂
16+
原厂封装
10000
全新原装正品,代理优势渠道供应,欢迎来电咨询
询价
TE Connectivity
2022+
1
全新原装 货期两周
询价
QUALCOMM/高通
21+
BGA
1574
询价
QUALCOMM
ROHS/new original
QFN68
10500
原装元器件供应现货支持。咨询更多现货库存,支持样
询价
QUALCOMM
23+
QFN68
10500
原装元器件供应现货支持。咨询更多现货库存,支持样
询价
QUALCOMM
23+
QFN68
7566
原厂原装
询价
QUALCOMM
23+
BGA
50000
全新原装正品现货,支持订货
询价
QUALCOMM/高通
23+
QFN
50000
全新原装正品现货,支持订货
询价
CSR/Qualcomm
2021+
QFN
7600
原装现货,欢迎询价
询价
CSR/Qualcomm
24+
QFN
30000
原装正品公司现货,假一赔十!
询价
更多QCC3供应商 更新时间2026-1-19 10:16:00