首页>QC7CB12.0000FSA32R>规格书详情
QC7CB12.0000FSA32R中文资料QANTEK数据手册PDF规格书
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QC7CB12.0000FSA32R规格书详情
特性 Features
• All ceramic epoxy sealed SMD package
• Low in height, suitable for thin equipment
• Tight tolerance and stability available
Applications
• High density applications
• Modem, communication and test equipment
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TE泰科 |
25+ |
连接器附件 |
13250 |
原装正品现货供应商原厂货源渠道订货 |
询价 | ||
INTEL |
原厂封装 |
9800 |
原装进口公司现货假一赔百 |
询价 | |||
INTEL/英特尔 |
23+ |
BGA |
3000 |
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、 |
询价 | ||
INTEL |
25+23+ |
BGA |
54507 |
绝对原装正品现货,全新深圳原装进口现货 |
询价 | ||
Intel |
23+ |
352-BGA |
11200 |
主营:汽车电子,停产物料,军工IC |
询价 | ||
TE/泰科 |
24+ |
31850 |
原厂现货渠道 |
询价 | |||
INTEL |
24+ |
55 |
询价 | ||||
INTEL |
16+ |
QFN |
2500 |
进口原装现货/价格优势! |
询价 | ||
AMCC |
2023+ |
BGA |
50000 |
原装现货 |
询价 | ||
QANTEK |
2022+ |
原厂原包装 |
6800 |
全新原装 支持表配单 中国著名电子元器件独立分销 |
询价 |
